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SMDJ75CA

hongjiacheng · ESD And Surge Protection (TVS/ESD) · SMC(DO-214AB)

SMDJ75CA from hongjiacheng, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer hongjiacheng
Package SMC(DO-214AB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage (bidirectional) VBR 83.3 92.1 V @IT = 1 mA 3
Maximum clamping voltage VC 121 V @IPP = 24.8 A 3
Reverse leakage current IR 2 μA @VRWM = 75 V 3
Peak pulse power dissipation PPPM 3000 W 10/1000µs waveform (Fig.1) (Note 1, Note 2) 1
Power dissipation on infinite heat sink PM(AV) 6.5 W Ta=75°C (Fig.5) 1
Operating junction and storage temperature range TJ, TSTG -55 150 ℃ 1
VBR voltage tolerance (bidirectional) -5 5 % SMDJXXXCA 5% VBR voltage tolerance 5
Typical maximum temperature coefficient of VBR ΔVBR 0.1 % ΔVBR = 0.1% × VBR@25℃ × ΔT, typical maximum 1
Reverse stand-off voltage VRWM 75 V 3
Typical thermal resistance junction to lead RθJ-L 15 ℃/W 1
Typical thermal resistance junction to ambient RθJ-A 75 ℃/W Mounted on 8.0mm x 8.0mm copper pads to each terminal (Note 2) 1
ESD immunity (contact) 30 KV IEC 61000-4-2 contact 1
ESD immunity (air) 30 KV IEC 61000-4-2 air 1
High temperature soldering at terminals 260 ℃ 10 seconds at terminals 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin •Matte tin lead-free Plated •Meets MSL level 1, per J-STD-020 1

CAD (KiCad official)

  • Symbol: SMDJ75CA
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: smdj75ca-etched.step / smdj75ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smdj75ca.step / smdj75ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: hongjiacheng datasheet (5 pp, sha256 a3e249276a89ca63, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF