# SMD24PLHE3-TP

**MCC Micro Commercial Components** · Schottky Diodes · SOD-123FL

SMD24PLHE3-TP from MCC Micro Commercial Components, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage |  |  |  | 40 | V |  | 1 |
| Maximum RMS Voltage |  |  |  | 28 | V |  | 1 |
| Maximum DC Blocking Voltage |  |  |  | 40 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 2 | A | TL=90°C | 1 |
| Power Dissipation | PD |  |  | 1.68 | W |  | 1 |
| Surge Forward Current | IFSM |  |  | 50 | A | 8.3ms, Half Sine; TJ=25°C | 1 |
| Maximum Forward Voltage | VF |  |  | 0.55 | V | IFM=2.0A; TJ=25°C | 1 |
| Maximum DC Reverse Current | IR |  |  | 0.1 | mA | TJ=25°C | 1 |
| Typical Junction Capacitance | CJ |  | 115 |  | pF | f=1.0MHz, VR=4V | 1 |
| Operating Junction Temperature Range |  | -55 |  | 150 | °C | SMD22PLHE3~SMD26PLHE3 group | 1 |
| Storage Temperature Range |  | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance Junction to Ambient |  |  | 60 |  | °C/W | PC board mounted on 0.2*0.2in (5*5mm) copper pad area (Note 3) | 1 |
| Typical Thermal Resistance Junction to Case |  |  | 30 |  | °C/W | PC board mounted on 0.2*0.2in (5*5mm) copper pad area (Note 3) | 1 |
| Typical Thermal Resistance Junction to Lead |  |  | 21 |  | °C/W | PC board mounted on 0.2*0.2in (5*5mm) copper pad area (Note 3) | 1 |

## CAD (KiCad official)

- Symbol: `SMD24PLHE3-TP`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files: `smd24plhe3-tp-etched.step` / `smd24plhe3-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd24plhe3-tp.step` / `smd24plhe3-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC Micro Commercial Components datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603065689313984512) (4 pp, sha256 `ac817a07d13eb288`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smd24plhe3-tp-datasheet.pdf)