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Ray Publish 0.1.0 557611b 21d ago

SMD1812-300-6

hongjiacheng · Resettable Fuses · 1812

SMD1812-300-6 from hongjiacheng, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the non-polarized PTC resettable fuse (Ihold 3.0A, Itrip 6.0A, Vmax 6V, Imax 40A); the device is symmetric and either terminal may be used.
2 2 passive Second terminal of the non-polarized PTC resettable fuse, in series with terminal 1 (Ri min 0.01Ω, R1 max 0.05Ω).

Key specifications

Parameter Value
Manufacturer hongjiacheng
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Hold current (Ihold) Ihold 3 A 25℃ still air; maximum current passed without tripping (vocabulary definition) 3
Trip current (Itrip) Itrip 6 A 25℃ still air; minimum current at which device trips (vocabulary definition) 3
Maximum voltage Vmax 6 V At rated current (Imax) 3
Maximum fault current Imax 40 A At rated voltage (Vmax) 3
Power dissipated in tripped state Pd 1.2 W Typical, tripped state, 25℃ still air 3
Max. time-to-trip 4 s Max. column value 8.0 A as printed in table row 3
Minimum resistance, initial (un-soldered) state Ri 0.01 Ω Initial un-soldered state, Ta=25℃ 3
Maximum resistance after trip or reflow R1 0.05 Ω 25℃, measured one hour after tripping or reflow soldering at 260℃ for 20 sec 3
Operating / storage temperature -40 85 ℃ Environmental specification for SMD1812 series 5
Maximum device surface temperature in tripped state 125 ℃ Tripped state 5
Preheat temperature TS(min) TS(min) 150 ℃ Pb-free reflow profile; printed as +150℃ (min of preheat band) 1
Preheat temperature TS(max) TS(max) 200 ℃ Pb-free reflow profile 1
Preheat time tS tS 60 180 s Pb-free reflow profile, TS(min) to TS(max) 1
Liquidus temperature TL TL 217 ℃ Pb-free reflow profile 1
Time above liquidus tL tL 60 150 s Pb-free reflow profile 1
Peak temperature TP TP 260 ℃ Pb-free reflow; printed +260(+0/-5)℃; do not exceed +260℃ 1
Time within 5℃ of peak temperature tP tP 20 40 s Pb-free reflow profile 1
Ramp-up rate 3 ℃/s TS(max) to TL and average ramp from TL to peak 1
Ramp-down rate 6 ℃/s Peak to end of reflow 1
Time 25℃ to peak temperature 8 min 25℃ to peak temperature 1

CAD (KiCad official)

  • Symbol: SMD1812-300-6
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: smd1812-300-6-etched.step / smd1812-300-6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd1812-300-6.step / smd1812-300-6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: hongjiacheng datasheet (6 pp, sha256 8ab1f213bc6d6cd2, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF