component
SMD1812-260-16
Public Made by Adomby adom
hongjiacheng Resettable Fuses, 1812. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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SMD1812-260-16
hongjiacheng · Resettable Fuses · 1812
SMD1812-260-16 from hongjiacheng, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | hongjiacheng |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (max, not tripping at 25℃ still air) | Ihold | 2.6 | A | Ta=25℃ still air | 3 | ||
| Trip current (min) | Itrip | 5.2 | A | Ta=25℃ still air | 3 | ||
| Maximum voltage withstand at rated current | Vmax | 16 | V | at rated current (Imax) | 3 | ||
| Maximum fault current withstand at rated voltage | Imax | 40 | A | at rated voltage (Vmax) | 3 | ||
| Minimum resistance in initial un-soldered state | Ri | 0.01 | Ω | initial (un-soldered) state | 3 | ||
| Maximum resistance at 25℃ after tripping or reflow | R1 | 0.07 | Ω | 25℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec | 3 | ||
| Time-to-trip (max) | 2.5 | Sec | 3 | ||||
| Typical power dissipated in tripped state | Pd | 1.2 | W | tripped state, 25℃ still air | 3 | ||
| Operating / storage temperature | -40 | 85 | ℃ | operating / storage | 5 | ||
| Maximum device surface temperature in tripped state | 125 | ℃ | tripped state | 5 | |||
| Preheat temperature TS(min) | TS(min) | 150 | ℃ | Pb-free reflow profile | 1 | ||
| Preheat temperature TS(max) | TS(max) | 200 | ℃ | Pb-free reflow profile | 1 | ||
| Preheat time tS (min to max) | tS | 60 | 180 | secs. | Pb-free reflow profile, TS(min) to TS(max) | 1 | |
| Average ramp-up rate (TL to peak) | 3 | ℃/sec. | liquidus temp (TL) to peak | 1 | |||
| Ramp-up rate TS(max) to TL | 3 | ℃/sec. | TS(max) to TL | 1 | |||
| Time above liquidus tL | tL | 60 | 150 | secs. | Temperature (tL) | 1 | |
| Peak temperature TP (do not exceed) | TP | 260 | ℃ | Peak Temp (TP); Do not exceed +260℃ | 1 | ||
| Time within 5℃ of actual peak temperature | tP | 20 | 40 | secs | within 5℃ of peak temp | 1 | |
| Ramp-down rate | 6 | ℃/sec | from peak | 1 | |||
| Time 25℃ to peak temperature | 8 | min. | 25℃ to peak temp (TP) | 1 | |||
| Maximum paste thickness | 0.25 | mm | recommended maximum paste thickness | 1 |
CAD (KiCad official)
- Symbol:
SMD1812-260-16 - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
smd1812-260-16-etched.step/smd1812-260-16-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1812-260-16.step/smd1812-260-16.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: hongjiacheng datasheet (6 pp, sha256
8ab1f213bc6d6cd2, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMD1812-260-16
**hongjiacheng** · Resettable Fuses · 1812
SMD1812-260-16 from hongjiacheng, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | hongjiacheng |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (max, not tripping at 25℃ still air) | Ihold | | | 2.6 | A | Ta=25℃ still air | 3 |
| Trip current (min) | Itrip | 5.2 | | | A | Ta=25℃ still air | 3 |
| Maximum voltage withstand at rated current | Vmax | | | 16 | V | at rated current (Imax) | 3 |
| Maximum fault current withstand at rated voltage | Imax | | | 40 | A | at rated voltage (Vmax) | 3 |
| Minimum resistance in initial un-soldered state | Ri | 0.01 | | | Ω | initial (un-soldered) state | 3 |
| Maximum resistance at 25℃ after tripping or reflow | R1 | | | 0.07 | Ω | 25℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec | 3 |
| Time-to-trip (max) | | | | 2.5 | Sec | | 3 |
| Typical power dissipated in tripped state | Pd | | 1.2 | | W | tripped state, 25℃ still air | 3 |
| Operating / storage temperature | | -40 | | 85 | ℃ | operating / storage | 5 |
| Maximum device surface temperature in tripped state | | | | 125 | ℃ | tripped state | 5 |
| Preheat temperature TS(min) | TS(min) | 150 | | | ℃ | Pb-free reflow profile | 1 |
| Preheat temperature TS(max) | TS(max) | | | 200 | ℃ | Pb-free reflow profile | 1 |
| Preheat time tS (min to max) | tS | 60 | | 180 | secs. | Pb-free reflow profile, TS(min) to TS(max) | 1 |
| Average ramp-up rate (TL to peak) | | | | 3 | ℃/sec. | liquidus temp (TL) to peak | 1 |
| Ramp-up rate TS(max) to TL | | | | 3 | ℃/sec. | TS(max) to TL | 1 |
| Time above liquidus tL | tL | 60 | | 150 | secs. | Temperature (tL) | 1 |
| Peak temperature TP (do not exceed) | TP | | | 260 | ℃ | Peak Temp (TP); Do not exceed +260℃ | 1 |
| Time within 5℃ of actual peak temperature | tP | 20 | | 40 | secs | within 5℃ of peak temp | 1 |
| Ramp-down rate | | | | 6 | ℃/sec | from peak | 1 |
| Time 25℃ to peak temperature | | | | 8 | min. | 25℃ to peak temp (TP) | 1 |
| Maximum paste thickness | | | | 0.25 | mm | recommended maximum paste thickness | 1 |
## CAD (KiCad official)
- Symbol: `SMD1812-260-16`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `smd1812-260-16-etched.step` / `smd1812-260-16-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd1812-260-16.step` / `smd1812-260-16.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [hongjiacheng datasheet](docs/smd1812-260-16-datasheet.pdf) (6 pp, sha256 `8ab1f213bc6d6cd2`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smd1812-260-16-datasheet.pdf)