# SMD1812-250

**BORN** · Resettable Fuses · 1812

SMD1812-250 from BORN, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the non-polarized resettable PPTC fuse (SMD1812-250: I-hold 2.50 A, I-trip 5.00 A, Vmax 8 Vdc at Imax 100 A); either end terminal may be used as the input. |
| 2 | 2 | passive | Terminal 2 of the non-polarized resettable PPTC fuse (SMD1812-250: I-hold 2.50 A, I-trip 5.00 A, Vmax 8 Vdc at Imax 100 A); either end terminal may be used as the input. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (maximum current that does not trip at 25 °C still air) | I-hold |  |  | 2.5 | A | 25 °C still air | 2 |
| Trip current (minimum current that trips at 25 °C still air) | I-trip | 5 |  |  | A | 25 °C still air | 2 |
| Minimum resistance in initial un-soldered state | R0 | 0.015 |  |  | Ohm | initial un-soldered state | 2 |
| Maximum resistance at 25 °C one hour after tripping or 260 °C reflow for 20 s | R1 |  |  | 0.075 | Ohm | 25 °C, one hour after trip or reflow | 2 |
| Maximum fault current withstood at rated voltage (Vmax) | Imax |  |  | 100 | A | at rated voltage Vmax | 2 |
| Maximum time to trip |  |  |  | 5 | Sec. | at 8.00 A, 25 °C | 2 |
| Maximum device surface temperature in tripped state |  |  |  | 125 | °C | tripped state | 3 |
| Operating temperature range |  | -40 |  | 85 | °C |  | 3 |
| Passive aging resistance change |  | -5 |  | 5 | % | +85 °C, 1000 hours | 3 |
| Humidity aging resistance change |  | -5 |  | 5 | % | +85 °C, 85 % R.H., 1000 hours | 3 |
| Thermal shock resistance change (typical) |  |  | -30 |  | % | MIL-STD-202 Method 107, +85 °C to -40 °C, 20 cycles | 3 |
| Recommended hold current at ambient -40 °C |  |  | 3.27 |  | A | ambient -40 °C | 4 |
| Recommended hold current at ambient 85 °C |  |  | 1.57 |  | A | ambient 85 °C | 4 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Material Tin-Plated Nickle-Copper (Solder Material: | 7 |

## CAD (KiCad official)

- Symbol: `SMD1812-250`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `smd1812-250-etched.step` / `smd1812-250-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd1812-250.step` / `smd1812-250.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BORN datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590923228862750720) (8 pp, sha256 `45b47bf27b785b39`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smd1812-250-datasheet.pdf)