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SMD1812-200-8

hongjiacheng · Resettable Fuses · 1812

SMD1812-200-8 from hongjiacheng, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the non-polarized PTC resettable fuse (Ihold 2.0A, Itrip 4.0A, Vmax 8V, Imax 40A); the device is symmetric and either terminal may be used as pin 1.
2 2 passive Second terminal of the non-polarized PTC resettable fuse (Ihold 2.0A, Itrip 4.0A, Vmax 8V, Imax 40A); the device is symmetric and either terminal may be used as pin 2.

Key specifications

Parameter Value
Manufacturer hongjiacheng
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum resistance in initial (un-soldered) state (Ri min) Ri min 0.02 Ω Initial un-soldered state 3
Maximum resistance at 25℃ after tripping or reflow (R1 max) R1 max 0.1 Ω 25℃, measured one hour after tripping or reflow soldering at 260℃ for 20 sec 3
Hold current (Ihold) Ihold 2 A 25℃ still air; maximum current device passes without tripping 3
Trip current (Itrip) Itrip 4 A 25℃ still air; minimum current at which device trips 3
Maximum voltage (Vmax) Vmax 8 V Maximum voltage device can withstand without damage at rated current (Imax) 3
Maximum fault current (Imax) Imax 40 A Maximum fault current device can withstand without damage at rated voltage (Vmax) 3
Maximum time-to-trip 2 s Max. Time-to-trip column (A)(Sec); printed current entry 8.0 A 3
Typical power dissipated in tripped state (Pd typ) Pd 1 W Tripped state, 25℃ still air 3
Operating / storage temperature -40 85 ℃ Operating / storage temperature 5
Maximum device surface temperature in tripped state 125 ℃ Tripped state 5
Peak temperature (TP) for Pb-free reflow TP 260 ℃ Printed as +260(+0/-5)℃; do not exceed +260℃ 1
Preheat temperature TS(min) to TS(max) TS 150 200 ℃ Pb-free reflow preheat, 60-180 s 1
Hold current derating, family row SMD1812-200 at -40℃ ambient Ihold 2.88 A Ambient -40℃; family row SMD1812-200 (not suffix-specific) 4
Hold current derating, family row SMD1812-200 at 25℃ ambient Ihold 2 A Ambient 25℃; family row SMD1812-200 (not suffix-specific) 4
Hold current derating, family row SMD1812-200 at 85℃ ambient Ihold 0.8 A Ambient 85℃; family row SMD1812-200 (not suffix-specific) 4

CAD (KiCad official)

  • Symbol: SMD1812-200-8
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: smd1812-200-8-etched.step / smd1812-200-8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd1812-200-8.step / smd1812-200-8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: hongjiacheng datasheet (6 pp, sha256 8ab1f213bc6d6cd2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF