# SMD1812-200-12

**hongjiacheng** · Resettable Fuses · 1812

SMD1812-200-12 from hongjiacheng, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal pad of the non-polarized PPTC device (1.7±0.1 mm pad, 3.5±0.1 mm tall), rated Ihold 2.0 A, Itrip 4.0 A, Vmax 12 V, Imax 40 A. |
| 2 | 2 | passive | Second terminal pad of the non-polarized PPTC device, 3.0±0.1 mm pad gap, with resistance of 0.02 Ω min initial and 0.10 Ω max after trip or reflow. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | hongjiacheng |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current | Ihold |  |  | 2 | A | 25℃ still air; maximum current device passes without tripping | 3 |
| Trip current | Itrip | 4 |  |  | A | 25℃ still air; minimum current at which device trips | 3 |
| Maximum voltage | Vmax |  |  | 12 | V | Maximum voltage device can withstand without damage at rated current (Imax) | 3 |
| Maximum fault current | Imax |  |  | 40 | A | Maximum fault current device can withstand without damage at rated voltage (Vmax) | 3 |
| Max. time-to-trip |  |  |  | 2 | s | Test current 8.0 A (printed in same row) | 3 |
| Minimum resistance in initial (un-soldered) state | Ri | 0.02 |  |  | Ω | Initial (un-soldered) state | 3 |
| Maximum resistance at 25℃ after trip or reflow | R1 |  |  | 0.1 | Ω | 25℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec | 3 |
| Typical power dissipated in tripped state | Pd |  | 1 |  | W | Tripped state at 25℃ still air | 3 |
| Operating / storage temperature |  | -40 |  | 85 | ℃ | Operating / storage | 5 |
| Maximum device surface temperature in tripped state |  |  |  | 125 | ℃ | Tripped state | 5 |
| Peak reflow temperature (TP) | TP |  |  | 260 | ℃ | Pb-free reflow profile; do not exceed +260℃; printed as +260(+0/-5)℃ | 1 |

## CAD (KiCad official)

- Symbol: `SMD1812-200-12`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `smd1812-200-12-etched.step` / `smd1812-200-12-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd1812-200-12.step` / `smd1812-200-12.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [hongjiacheng datasheet](docs/smd1812-200-12-datasheet.pdf) (6 pp, sha256 `8ab1f213bc6d6cd2`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smd1812-200-12-datasheet.pdf)