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Contents

README

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SMD1812-050-33

hongjiacheng · Resettable Fuses · 1812

SMD1812-050-33 from hongjiacheng, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the non-polarized resettable PTC fuse (Ihold 0.50 A, Itrip 1.0 A, Vmax 33 V, Imax 40 A), with a recommended pad 1.7±0.1 mm wide by 3.5±0.1 mm long.
2 2 passive The other terminal of the non-polarized resettable PTC fuse, with the pads spaced 3.0±0.1 mm apart on the recommended layout.

Key specifications

Parameter Value
Manufacturer hongjiacheng
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Hold current (Ihold) Ihold 0.5 A Maximum current device will pass without tripping in 25℃ still air 2
Trip current (Itrip) Itrip 1 A Minimum current at which the device will trip in 25℃ still air 2
Maximum voltage (Vmax) Vmax 33 V Maximum voltage device can withstand without damage at rated current (Imax) 2
Maximum fault current (Imax) Imax 40 A Maximum fault current device can withstand without damage at rated voltage (Vmax) 2
Typical power dissipation in tripped state (Pd typ) Pd 1 W Typical power dissipated from device when in the tripped state at 25℃ still air 2
Maximum time-to-trip 8 s 2
Minimum resistance in initial state (Ri min) Ri 0.15 Ω Minimum resistance of device in initial (un-soldered) state 2
Maximum resistance at 25℃ after trip or reflow (R1 max) R1 1.4 Ω At 25℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec 2
Operating / storage temperature -40 85 ℃ Operating / storage temperature 5
Maximum device surface temperature in tripped state 125 ℃ Maximum device surface temperature in tripped state 5
Peak reflow temperature (TP) TP 260 ℃ Pb-free reflow; do not exceed +260℃ 1

CAD (KiCad official)

  • Symbol: SMD1812-050-33
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: smd1812-050-33-etched.step / smd1812-050-33-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd1812-050-33.step / smd1812-050-33.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: hongjiacheng datasheet (6 pp, sha256 8ab1f213bc6d6cd2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF