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Contents

README

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SMD1812-014

BORN · Resettable Fuses · 1812

SMD1812-014 from BORN, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Non-polarized PPTC terminal (tin-plated nickel-copper); the device is a two-terminal series element, I-hold 0.14 A, I-trip 0.34 A, Vmax 60 Vdc (SMD1812-014/60N).
2 2 passive Non-polarized PPTC terminal (tin-plated nickel-copper); interchangeable with the other terminal, with recommended pad 1.50 mm x 3.20 mm and 2.70 mm pad gap.

Key specifications

Parameter Value
Manufacturer BORN
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Hold current (no trip at 25 °C still air) I-hold 0.14 A Maximum current at which device will not trip, 25 °C still air 2
Trip current (trips at 25 °C still air) I-trip 0.34 A Minimum current at which device will trip, 25 °C still air 2
Minimum initial resistance R0 min 1.2 Ohm Initial un-soldered state, measured at 25 °C 1
Maximum resistance after trip or reflow R1 max 6.5 Ohm 25 °C, measured one hour after tripping or reflow soldering at 260 °C for 20 s 1
Maximum voltage (rated voltage) Vmax 60 Vdc Maximum voltage device can withstand without damage at rated current (Imax) 1
Maximum fault current Imax 10 A Maximum fault current device can withstand without damage at rated voltage (Vmax) 1
Maximum time to trip 0.15 Sec. At specified current 1.50 A, 25 °C 1
Power dissipated in tripped state Pd 0.8 W Typical power dissipated when tripped, 25 °C still air 1
Operating temperature -40 85 °C Operating ambient temperature range 3
Maximum device surface temperature in tripped state 125 °C Tripped state 3
Passive aging resistance change -5 5 % +85 °C, 1000 hours; typical resistance change 3
Humidity aging resistance change -5 5 % +85 °C, 85 % R.H., 1000 hours; typical resistance change 3
Thermal shock resistance change -30 % MIL-STD-202 Method 107; +85 °C to -40 °C, 20 times; typical resistance change 3
Pb-free reflow peak classification temperature TP 260 °C Topside package temperature; tolerance +0/-5 °C 5
Time 25 °C to peak temperature 8 minutes Reflow profile, time from 25 °C to peak temperature (TP) 5
Recommended hold current at 50 °C ambient 0.1 A Thermal derating chart, ambient operating temperature 50 °C 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin Terminal Material Tin-Plated Nickle-Copper (Solder Material: 7

CAD (KiCad official)

  • Symbol: SMD1812-014
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: smd1812-014-etched.step / smd1812-014-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd1812-014.step / smd1812-014.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (8 pp, sha256 44aae6dface4a128, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF