component
SMD1210P200TF
Public Made by Adomby adom
RUILON Shenzhen Ruilongyuan Elec Resettable Fuses, 1210. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
SMD1210P200TF
RUILON Shenzhen Ruilongyuan Elec · Resettable Fuses · 1210
SMD1210P200TF from RUILON Shenzhen Ruilongyuan Elec, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RUILON Shenzhen Ruilongyuan Elec |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum trip current | Itrip | 4 | A | 25°C still air; minimum current at which device always trips | 2 | ||
| Maximum operating voltage | Vmax | 6 | VDC | Maximum voltage withstood without damage at rated current Imax | 2 | ||
| Maximum fault current | Imax | 35 | A | At rated voltage Vmax | 2 | ||
| Minimum resistance prior to tripping | Rimin | 0.015 | Ω | 25°C, prior to tripping | 2 | ||
| Maximum resistance one hour post reflow | R1max | 0.07 | Ω | Measured one hour post reflow | 2 | ||
| Maximum time to trip | Tmax | 1 | s | At 8.00 A test current | 2 | ||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 1 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in tripped state | 1 | |||
| Reflow preheat minimum temperature | Ts(min) | 150 | °C | Pb-free reflow preheat | 4 | ||
| Reflow preheat maximum temperature | Ts(max) | 200 | °C | Pb-free reflow preheat | 4 | ||
| Reflow ramp-up rate | 3 | °C/s | Pb-free reflow, Ts(max) to TL | 4 | |||
| Reflow ramp-down rate | 6 | °C/s | Pb-free reflow, from peak | 4 | |||
| Reflow peak temperature | TP | 260 | °C | Pb-free reflow; printed as 260 +0/-5°C; do not exceed 260°C | 4 | ||
| Time 25°C to peak temperature | 8 | min | Pb-free reflow | 4 | |||
| Soldering iron tool temperature | 350 | °C | Hand soldering, if soldering iron is used | 6 | |||
| Soldering iron contact time | 3 | s | Contact between iron tip and solder joint | 6 | |||
| Soldering iron distance from device | 1.5 | mm | Soldering position distance from PTC | 6 | |||
| Hold current | Ihold | 2 | A | Maximum current device will not trip in 25°C still air | 2 | ||
| Power dissipation in tripped state | Pd | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Hold current derating at -40°C ambient | Ih | 2.9 | A | Ambient -40 °C | 3 | ||
| Hold current derating at -20°C ambient | Ih | 2.63 | A | Ambient -20 °C | 3 | ||
| Hold current derating at 0°C ambient | Ih | 2.31 | A | Ambient 0 °C | 3 | ||
| Hold current derating at 25°C ambient | Ih | 2 | A | Ambient 25 °C | 3 | ||
| Hold current derating at 40°C ambient | Ih | 1.68 | A | Ambient 40 °C | 3 | ||
| Hold current derating at 50°C ambient | Ih | 1.52 | A | Ambient 50 °C | 3 | ||
| Hold current derating at 60°C ambient | Ih | 1.35 | A | Ambient 60 °C | 3 | ||
| Hold current derating at 70°C ambient | Ih | 1.2 | A | Ambient 70 °C | 3 | ||
| Hold current derating at 85°C ambient | Ih | 0.98 | A | Ambient 85 °C | 3 |
CAD (KiCad official)
- Symbol:
SMD1210P200TF - Footprint:
Fuse:Fuse_1210_3225Metric - 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files:
smd1210p200tf-etched.step/smd1210p200tf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1210p200tf.step/smd1210p200tf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RUILON Shenzhen Ruilongyuan Elec datasheet (7 pp, sha256
1b912bbc16f34b5c, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMD1210P200TF
**RUILON Shenzhen Ruilongyuan Elec** · Resettable Fuses · 1210
SMD1210P200TF from RUILON Shenzhen Ruilongyuan Elec, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RUILON Shenzhen Ruilongyuan Elec |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum trip current | Itrip | 4 | | | A | 25°C still air; minimum current at which device always trips | 2 |
| Maximum operating voltage | Vmax | | | 6 | VDC | Maximum voltage withstood without damage at rated current Imax | 2 |
| Maximum fault current | Imax | | | 35 | A | At rated voltage Vmax | 2 |
| Minimum resistance prior to tripping | Rimin | 0.015 | | | Ω | 25°C, prior to tripping | 2 |
| Maximum resistance one hour post reflow | R1max | | | 0.07 | Ω | Measured one hour post reflow | 2 |
| Maximum time to trip | Tmax | | | 1 | s | At 8.00 A test current | 2 |
| Ambient operating temperature | | -40 | | 85 | °C | Ambient operating conditions | 1 |
| Maximum surface temperature in tripped state | | | | 125 | °C | Device in tripped state | 1 |
| Reflow preheat minimum temperature | Ts(min) | 150 | | | °C | Pb-free reflow preheat | 4 |
| Reflow preheat maximum temperature | Ts(max) | | | 200 | °C | Pb-free reflow preheat | 4 |
| Reflow ramp-up rate | | | | 3 | °C/s | Pb-free reflow, Ts(max) to TL | 4 |
| Reflow ramp-down rate | | | | 6 | °C/s | Pb-free reflow, from peak | 4 |
| Reflow peak temperature | TP | | | 260 | °C | Pb-free reflow; printed as 260 +0/-5°C; do not exceed 260°C | 4 |
| Time 25°C to peak temperature | | | | 8 | min | Pb-free reflow | 4 |
| Soldering iron tool temperature | | | | 350 | °C | Hand soldering, if soldering iron is used | 6 |
| Soldering iron contact time | | | | 3 | s | Contact between iron tip and solder joint | 6 |
| Soldering iron distance from device | | 1.5 | | | mm | Soldering position distance from PTC | 6 |
| Hold current | Ihold | | 2 | | A | Maximum current device will not trip in 25°C still air | 2 |
| Power dissipation in tripped state | Pd | | 0.8 | | W | Tripped state, 25°C still air, at rated voltage | 2 |
| Hold current derating at -40°C ambient | Ih | | 2.9 | | A | Ambient -40 °C | 3 |
| Hold current derating at -20°C ambient | Ih | | 2.63 | | A | Ambient -20 °C | 3 |
| Hold current derating at 0°C ambient | Ih | | 2.31 | | A | Ambient 0 °C | 3 |
| Hold current derating at 25°C ambient | Ih | | 2 | | A | Ambient 25 °C | 3 |
| Hold current derating at 40°C ambient | Ih | | 1.68 | | A | Ambient 40 °C | 3 |
| Hold current derating at 50°C ambient | Ih | | 1.52 | | A | Ambient 50 °C | 3 |
| Hold current derating at 60°C ambient | Ih | | 1.35 | | A | Ambient 60 °C | 3 |
| Hold current derating at 70°C ambient | Ih | | 1.2 | | A | Ambient 70 °C | 3 |
| Hold current derating at 85°C ambient | Ih | | 0.98 | | A | Ambient 85 °C | 3 |
## CAD (KiCad official)
- Symbol: `SMD1210P200TF`
- Footprint: `Fuse:Fuse_1210_3225Metric`
- 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files: `smd1210p200tf-etched.step` / `smd1210p200tf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd1210p200tf.step` / `smd1210p200tf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [RUILON Shenzhen Ruilongyuan Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586172386533761024) (7 pp, sha256 `1b912bbc16f34b5c`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smd1210p200tf-datasheet.pdf)