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SMD1210P020TF
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RUILON Shenzhen Ruilongyuan Elec Resettable Fuses, 1210. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SMD1210P020TF
RUILON Shenzhen Ruilongyuan Elec · Resettable Fuses · 1210
SMD1210P020TF from RUILON Shenzhen Ruilongyuan Elec, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Non-polarized PTC terminal on one end of the 1210 body, in series with the protected line; the device is rated Ihold 0.20 A, Itrip 0.40 A, Vmax 30 VDC and Imax 8.00 A. |
| 2 | 2 | passive | Non-polarized PTC terminal on the opposite end of the 1210 body, in series with the protected line; the device is rated Ihold 0.20 A, Itrip 0.40 A, Vmax 30 VDC and Imax 8.00 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RUILON Shenzhen Ruilongyuan Elec |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current | Ihold | 0.2 | A | 25°C still air; device will not trip | 2 | ||
| Trip current | Itrip | 0.4 | A | 25°C still air; device always trips | 2 | ||
| Maximum operating voltage | Vmax | 30 | VDC | Rated current (Imax) | 2 | ||
| Maximum time to trip | Tmax | 0.02 | S | Test current 8.00 A | 2 | ||
| Maximum fault current | Imax | 30 | A | At rated voltage (Vmax) | 2 | ||
| Power dissipation in tripped state | Pd | 0.6 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Minimum device resistance prior to tripping | Rimin | 0.4 | Ω | 25°C, prior to tripping | 2 | ||
| Maximum device resistance after reflow | R1max | 5 | Ω | Measured one hour post reflow | 2 | ||
| Resistance change, passive aging | -5 | 5 | % | +85℃, 1000 hrs; typical | 1 | ||
| Resistance change, humidity aging | -5 | 5 | % | +85℃, 85%R.H., 168 hours; typical | 1 | ||
| Resistance change, thermal shock | -33 | 33 | % | +85℃ to -40℃, 20 times; typical | 1 | ||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 1 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in tripped state | 1 | |||
| Thermal derating hold current Ih | Ih | 0.29 | A | Ambient operation temperature -40 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.26 | A | Ambient operation temperature -20 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.22 | A | Ambient operation temperature 0 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.2 | A | Ambient operation temperature 25 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.16 | A | Ambient operation temperature 40 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.14 | A | Ambient operation temperature 50 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.13 | A | Ambient operation temperature 60 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.11 | A | Ambient operation temperature 70 ºC | 3 | ||
| Thermal derating hold current Ih | Ih | 0.08 | A | Ambient operation temperature 85 ºC | 3 | ||
| Preheat temperature Ts(min) | Ts(min) | 150 | °C | Pb-free reflow preheat | 4 | ||
| Preheat temperature Ts(max) | Ts(max) | 200 | °C | Pb-free reflow preheat | 4 | ||
| Preheat time ts | ts | 60 | 180 | s | Ts(min) to Ts(max), Pb-free reflow | 4 | |
| Ramp-up rate | 3 | °C/s | Average, TS(max) to TL, Pb-free reflow | 4 | |||
| Liquidus temperature TL | TL | 217 | °C | Pb-free reflow | 4 | ||
| Time above liquidus | tL | 60 | 150 | s | Pb-free reflow | 4 | |
| Peak temperature TP | TP | 260 | °C | Pb-free reflow; TP 260 +0/-5 °C; do not exceed 260 °C | 4 | ||
| Time within 5°C of peak temperature | tp | 20 | 40 | s | Pb-free reflow | 4 | |
| Ramp-down rate | 6 | °C/s | Pb-free reflow | 4 | |||
| Time from 25°C to peak temperature | 8 | min | Pb-free reflow | 4 |
CAD (KiCad official)
- Symbol:
SMD1210P020TF - Footprint:
Fuse:Fuse_1210_3225Metric - 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files:
smd1210p020tf-etched.step/smd1210p020tf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1210p020tf.step/smd1210p020tf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RUILON Shenzhen Ruilongyuan Elec datasheet (7 pp, sha256
1b912bbc16f34b5c, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMD1210P020TF
**RUILON Shenzhen Ruilongyuan Elec** · Resettable Fuses · 1210
SMD1210P020TF from RUILON Shenzhen Ruilongyuan Elec, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Non-polarized PTC terminal on one end of the 1210 body, in series with the protected line; the device is rated Ihold 0.20 A, Itrip 0.40 A, Vmax 30 VDC and Imax 8.00 A. |
| 2 | 2 | passive | Non-polarized PTC terminal on the opposite end of the 1210 body, in series with the protected line; the device is rated Ihold 0.20 A, Itrip 0.40 A, Vmax 30 VDC and Imax 8.00 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RUILON Shenzhen Ruilongyuan Elec |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current | Ihold | | | 0.2 | A | 25°C still air; device will not trip | 2 |
| Trip current | Itrip | 0.4 | | | A | 25°C still air; device always trips | 2 |
| Maximum operating voltage | Vmax | | | 30 | VDC | Rated current (Imax) | 2 |
| Maximum time to trip | Tmax | | | 0.02 | S | Test current 8.00 A | 2 |
| Maximum fault current | Imax | | | 30 | A | At rated voltage (Vmax) | 2 |
| Power dissipation in tripped state | Pd | | 0.6 | | W | Tripped state, 25°C still air, at rated voltage | 2 |
| Minimum device resistance prior to tripping | Rimin | 0.4 | | | Ω | 25°C, prior to tripping | 2 |
| Maximum device resistance after reflow | R1max | | | 5 | Ω | Measured one hour post reflow | 2 |
| Resistance change, passive aging | | -5 | | 5 | % | +85℃, 1000 hrs; typical | 1 |
| Resistance change, humidity aging | | -5 | | 5 | % | +85℃, 85%R.H., 168 hours; typical | 1 |
| Resistance change, thermal shock | | -33 | | 33 | % | +85℃ to -40℃, 20 times; typical | 1 |
| Ambient operating temperature | | -40 | | 85 | °C | Ambient operating conditions | 1 |
| Maximum surface temperature in tripped state | | | | 125 | °C | Device in tripped state | 1 |
| Thermal derating hold current Ih | Ih | | | 0.29 | A | Ambient operation temperature -40 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.26 | A | Ambient operation temperature -20 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.22 | A | Ambient operation temperature 0 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.2 | A | Ambient operation temperature 25 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.16 | A | Ambient operation temperature 40 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.14 | A | Ambient operation temperature 50 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.13 | A | Ambient operation temperature 60 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.11 | A | Ambient operation temperature 70 ºC | 3 |
| Thermal derating hold current Ih | Ih | | | 0.08 | A | Ambient operation temperature 85 ºC | 3 |
| Preheat temperature Ts(min) | Ts(min) | 150 | | | °C | Pb-free reflow preheat | 4 |
| Preheat temperature Ts(max) | Ts(max) | | | 200 | °C | Pb-free reflow preheat | 4 |
| Preheat time ts | ts | 60 | | 180 | s | Ts(min) to Ts(max), Pb-free reflow | 4 |
| Ramp-up rate | | | | 3 | °C/s | Average, TS(max) to TL, Pb-free reflow | 4 |
| Liquidus temperature TL | TL | | 217 | | °C | Pb-free reflow | 4 |
| Time above liquidus | tL | 60 | | 150 | s | Pb-free reflow | 4 |
| Peak temperature TP | TP | | | 260 | °C | Pb-free reflow; TP 260 +0/-5 °C; do not exceed 260 °C | 4 |
| Time within 5°C of peak temperature | tp | 20 | | 40 | s | Pb-free reflow | 4 |
| Ramp-down rate | | | | 6 | °C/s | Pb-free reflow | 4 |
| Time from 25°C to peak temperature | | | | 8 | min | Pb-free reflow | 4 |
## CAD (KiCad official)
- Symbol: `SMD1210P020TF`
- Footprint: `Fuse:Fuse_1210_3225Metric`
- 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files: `smd1210p020tf-etched.step` / `smd1210p020tf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd1210p020tf.step` / `smd1210p020tf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [RUILON Shenzhen Ruilongyuan Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586172562485760000) (7 pp, sha256 `1b912bbc16f34b5c`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smd1210p020tf-datasheet.pdf)