component
SMD1210B150TFT
Public Made by Adomby adom
Brightking Resettable Fuses, 1210. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 23d ago |
| viewers | 23d ago |
| package.json | 23d ago |
| page.json | 23d ago |
| README.md | 23d ago |
| smd1210b150tft-etched.glb | 23d ago |
| smd1210b150tft-etched.step | 23d ago |
| smd1210b150tft-hero.glb | 23d ago |
| smd1210b150tft-hero.overlay.json | 23d ago |
| smd1210b150tft.glb | 23d ago |
| smd1210b150tft.kicad_mod | 23d ago |
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| smd1210b150tft.lbr | 23d ago |
| smd1210b150tft.step | 23d ago |
SMD1210B150TFT
Brightking · Resettable Fuses · 1210
SMD1210B150TFT from Brightking, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the non-polarized PTC resettable fuse, a solder-plated copper end terminal on the 2.00 mm-gap pad layout (1.00 x 2.50 mm pad); rated Ihold 1.50 A, Itrip 3.00 A, Vmax 6 Vdc, Imax 100 A. |
| 2 | 2 | passive | Second terminal of the non-polarized PTC resettable fuse, a solder-plated copper end terminal on the 2.00 mm-gap pad layout (1.00 x 2.50 mm pad); rated Ihold 1.50 A, Itrip 3.00 A, Vmax 6 Vdc, Imax 100 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Brightking |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (Ihold) | Ihold | 1.5 | A | 23℃ still air; maximum current device passes without tripping | 2 | ||
| Trip current (Itrip) | Itrip | 3 | A | 23℃ still air; minimum current at which device trips | 2 | ||
| Maximum voltage (Vmax) | Vmax | 6 | Vdc | At rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 100 | A | At rated voltage (Vmax) | 2 | ||
| Power dissipated in tripped state (Pd) | Pd | 0.8 | W | Tripped state, 23℃ still air, typical | 2 | ||
| Maximum time to trip | Time To Trip | 0.3 | Sec. | At current 8.00 A | 2 | ||
| Minimum resistance (initial, un-soldered) | Rmin | 0.03 | Ω | Initial (un-soldered) state | 2 | ||
| Maximum resistance (R1max) | R1max | 0.12 | Ω | 23℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec. | 2 | ||
| Recommended hold current at ambient -40℃ | Ihold | 2.3 | A | Ambient operation temperature -40℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient -20℃ | Ihold | 2.02 | A | Ambient operation temperature -20℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 0℃ | Ihold | 1.76 | A | Ambient operation temperature 0℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 23℃ | Ihold | 1.5 | A | Ambient operation temperature 23℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 40℃ | Ihold | 1.24 | A | Ambient operation temperature 40℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 50℃ | Ihold | 1.11 | A | Ambient operation temperature 50℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 60℃ | Ihold | 1 | A | Ambient operation temperature 60℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 70℃ | Ihold | 0.85 | A | Ambient operation temperature 70℃ (thermal derating chart) | 4 | ||
| Recommended hold current at ambient 85℃ | Ihold | 0.65 | A | Ambient operation temperature 85℃ (thermal derating chart) | 4 | ||
| Operating / storage temperature | -40 | 85 | ℃ | Operating and storage | 7 | ||
| Maximum device surface temperature in tripped state | 125 | ℃ | Tripped state | 7 | |||
| Storage temperature (recommended storage condition) | 0 | 35 | ℃ | Storage, ≤70%RH | 6 | ||
| Passive aging resistance change | -50 | 50 | % | +85℃, 1000 hours; typical resistance change (printed ±50%) | 7 | ||
| Humidity aging resistance change | -50 | 50 | % | +85℃, 85% R.H., 1000 hours; typical resistance change (printed ±50%) | 7 | ||
| Thermal shock resistance change | -50 | % | MIL-STD-202 Method 107G, +85℃/-40℃, 20 cycles; typical resistance change | 7 |
CAD (KiCad official)
- Symbol:
SMD1210B150TFT - Footprint:
Fuse:Fuse_1210_3225Metric - 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files:
smd1210b150tft-etched.step/smd1210b150tft-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1210b150tft.step/smd1210b150tft.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Brightking datasheet (9 pp, sha256
02d03e61b9be4912, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).