component
SMD1210B005TF
Public Made by Adomby adom
Brightking Resettable Fuses, 1210. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Contents
README
markdownSMD1210B005TF
Brightking · Resettable Fuses · 1210
SMD1210B005TF from Brightking, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Brightking |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum trip current | Itrip | 0.15 | A | Minimum current at which the device will trip in 23℃ still air | 1 | ||
| Maximum fault current | Imax | 10 | A | Maximum fault current device can withstand without damage at rated voltage (Vmax) | 1 | ||
| Maximum voltage | Vmax | 30 | Vdc | Maximum voltage device can withstand without damage at rated current (Imax) | 1 | ||
| Minimum resistance (initial, un-soldered) | Rmin | 3.6 | Ω | Minimum resistance of device in initial (un-soldered) state | 1 | ||
| Maximum resistance after trip or reflow | R1max | 50 | Ω | Maximum resistance at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec | 1 | ||
| Maximum hold current | Ihold | 0.05 | A | Maximum current device will pass without tripping in 23℃ still air | 1 | ||
| Typical power dissipated in tripped state | Pd | 0.6 | W | Typical power dissipated from device when in the tripped state at 23℃ still air | 1 | ||
| Passive aging resistance change | -50 | 50 | % | +85℃, 1000 hours; typical resistance change | 7 | ||
| Humidity aging resistance change | -50 | 50 | % | +85℃, 85% R.H., 1000 hours; typical resistance change | 7 | ||
| Thermal shock resistance change | -50 | % | MIL-STD-202 Method 107G, +85℃ / -40℃, 20 times; typical resistance change | 7 | |||
| Operating / storage temperature | -40 | 85 | ℃ | Operating / storage temperature | 7 | ||
| Maximum device surface temperature in tripped state | 125 | ℃ | Maximum device surface temperature in tripped state | 7 | |||
| Reflow peak temperature | TP | 260 | ℃ | Pb-free reflow profile, peak temperature (TP) | 6 | ||
| Recommended hold current at ambient -40℃ | 0.08 | A | Recommended hold current at ambient temperature -40℃ | 4 | |||
| Recommended hold current at ambient -20℃ | 0.07 | A | Recommended hold current at ambient temperature -20℃ | 4 | |||
| Recommended hold current at ambient 0℃ | 0.06 | A | Recommended hold current at ambient temperature 0℃ | 4 | |||
| Recommended hold current at ambient 23℃ | 0.05 | A | Recommended hold current at ambient temperature 23℃ | 4 | |||
| Recommended hold current at ambient 40℃ | 0.04 | A | Recommended hold current at ambient temperature 40℃ | 4 | |||
| Recommended hold current at ambient 50℃ | 0.04 | A | Recommended hold current at ambient temperature 50℃ | 4 | |||
| Recommended hold current at ambient 60℃ | 0.03 | A | Recommended hold current at ambient temperature 60℃ | 4 | |||
| Recommended hold current at ambient 70℃ | 0.03 | A | Recommended hold current at ambient temperature 70℃ | 4 | |||
| Recommended hold current at ambient 85℃ | 0.02 | A | Recommended hold current at ambient temperature 85℃ | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) | 8 |
CAD (KiCad official)
- Symbol:
SMD1210B005TF - Footprint:
Fuse:Fuse_1210_3225Metric - 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files:
smd1210b005tf-etched.step/smd1210b005tf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1210b005tf.step/smd1210b005tf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Brightking datasheet (9 pp, sha256
02d03e61b9be4912, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).