component
SMD1210-050-16V
Public Made by Adomby adom
TECHFUSE Resettable Fuses, 1210. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMD1210-050-16V
TECHFUSE · Resettable Fuses · 1210
SMD1210-050-16V from TECHFUSE, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal pad of the non-polarized PPTC (hold current 0.50 A, trip 1.00 A, Vmax 16 Vdc, Imax 100 A); interchangeable with pin 2. |
| 2 | 2 | passive | Terminal pad of the non-polarized PPTC (hold current 0.50 A, trip 1.00 A, Vmax 16 Vdc, Imax 100 A); interchangeable with pin 1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated voltage (Vmax) | Vmax | 16 | Vdc | Maximum operating voltage device can withstand without damage at rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 100 | A | @25°C; maximum fault current device can withstand at rated voltage (Vmax) | 2 | ||
| Minimum device resistance prior to tripping (Rimin) | Rimin | 0.18 | Ω | @25°C | 2 | ||
| Maximum device resistance one hour post reflow (R1max) | R1max | 0.9 | Ω | Measured one hour post reflow | 2 | ||
| Hold current (Ihold) | Ihold | 0.5 | A | @25°C still air; maximum current device will not trip | 2 | ||
| Trip current (Itrip) | Itrip | 1 | A | @25°C still air; minimum current at which device will always trip | 2 | ||
| Power dissipation in tripped state (Pd) | Pd | 0.6 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Time to trip | 0.1 | Sec | Max. current 8.0 A, 25°C (column mapping inferred; see review_required) | 2 | |||
| Hold current vs maximum ambient temperature at -40°C | Ihold | 0.76 | A | Maximum ambient operating temperature Tmao = -40°C | 2 | ||
| Hold current vs maximum ambient temperature at -20°C | Ihold | 0.67 | A | Maximum ambient operating temperature Tmao = -20°C | 2 | ||
| Hold current vs maximum ambient temperature at 0°C | Ihold | 0.58 | A | Maximum ambient operating temperature Tmao = 0°C | 2 | ||
| Hold current vs maximum ambient temperature at 25°C | Ihold | 0.5 | A | Maximum ambient operating temperature Tmao = 25°C | 2 | ||
| Hold current vs maximum ambient temperature at 40°C | Ihold | 0.43 | A | Maximum ambient operating temperature Tmao = 40°C | 2 | ||
| Hold current vs maximum ambient temperature at 50°C | Ihold | 0.4 | A | Maximum ambient operating temperature Tmao = 50°C | 2 | ||
| Hold current vs maximum ambient temperature at 60°C | Ihold | 0.36 | A | Maximum ambient operating temperature Tmao = 60°C | 2 | ||
| Hold current vs maximum ambient temperature at 70°C | Ihold | 0.32 | A | Maximum ambient operating temperature Tmao = 70°C | 2 | ||
| Hold current vs maximum ambient temperature at 85°C | Ihold | 0.28 | A | Maximum ambient operating temperature Tmao = 85°C | 2 | ||
| Resistance change, passive aging | -5 | 5 | % | +85°C, 1000 hrs; ±5% typical | 2 | ||
| Resistance change, humidity aging | -5 | 5 | % | +85°C, 85% R.H., 168 hours; ±5% typical | 2 | ||
| Resistance change, thermal shock | -33 | 33 | % | +85°C to -40°C, 20 times; ±33% typical | 2 | ||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 2 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in the tripped state | 2 | |||
| Storage temperature | 40 | °C | Storage conditions; 70% R.H. max | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | F = Part identification Termination Pad Characteristics Terminal pad materials: Tin-plated Nickel-Copper Terminal pad solderability: Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rew | 3 |
CAD (KiCad official)
- Symbol:
SMD1210-050-16V - Footprint:
Fuse:Fuse_1210_3225Metric - 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files:
smd1210-050-16v-etched.step/smd1210-050-16v-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1210-050-16v.step/smd1210-050-16v.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TECHFUSE datasheet (4 pp, sha256
262a930cfe6527d4, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).