component
SMD1206B200TF
Public Made by Adomby adom
Brightking Resettable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
| smd1206b200tf-etched.glb | 17d ago |
| smd1206b200tf-etched.step | 17d ago |
| smd1206b200tf-hero.glb | 17d ago |
| smd1206b200tf-hero.overlay.json | 17d ago |
| smd1206b200tf.glb | 17d ago |
| smd1206b200tf.kicad_mod | 17d ago |
| smd1206b200tf.kicad_sym | 17d ago |
| smd1206b200tf.lbr | 17d ago |
| smd1206b200tf.step | 17d ago |
SMD1206B200TF
Brightking · Resettable Fuses · 1206
SMD1206B200TF from Brightking, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the non-polarized PTC resettable fuse (solder-plated copper, matte tin); Ihold 2.00A, Itrip 3.50A, Vmax 6Vdc, Imax 100A, recommended pad 1.00 x 1.80mm. |
| 2 | 2 | passive | Terminal 2 of the non-polarized PTC resettable fuse (solder-plated copper, matte tin); Ihold 2.00A, Itrip 3.50A, Vmax 6Vdc, Imax 100A, pads spaced 1.80mm apart. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Brightking |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (Ihold), maximum current device passes without tripping | Ihold | 2 | A | 1 | |||
| Trip current (Itrip), minimum current at which device trips | Itrip | 3.5 | A | 1 | |||
| Maximum time to trip | Time to trip | 1.5 | Sec. | at 8.00 A fault current | 1 | ||
| Minimum resistance in initial (un-soldered) state | Rmin | 0.018 | Ω | 1 | |||
| Maximum resistance at 23℃ after one hour post-trip or reflow | R1max | 0.08 | Ω | 1 | |||
| Maximum voltage device can withstand without damage | Vmax | 6 | Vdc | 1 | |||
| Maximum fault current device can withstand without damage | Imax | 100 | A | 1 | |||
| Typical power dissipated in tripped state | Pd | 0.8 | W | 1 | |||
| Passive aging resistance change | -50 | 50 | % | Passive aging at +85℃, 1000 hours; printed as typical resistance change | 6 | ||
| Humidity aging resistance change | -50 | 50 | % | Humidity aging at +85℃, 85%R.H., 1000 hours; printed as typical resistance change | 6 | ||
| Operating / storage temperature range | -40 | 85 | ℃ | Operating / storage temperature | 6 | ||
| Maximum device surface temperature in tripped state | 125 | ℃ | Tripped state | 6 | |||
| Peak temperature (TP) for Pb-free reflow | TP | 260 | ℃ | Pb-free assembly reflow profile | 5 | ||
| Recommended hold current at ambient | 2.6 | A | Ambient -40℃ | 3 | |||
| Recommended hold current at ambient | 2.44 | A | Ambient -20℃ | 3 | |||
| Recommended hold current at ambient | 2.35 | A | Ambient 0℃ | 3 | |||
| Recommended hold current at ambient | 2 | A | Ambient 23℃ | 3 | |||
| Recommended hold current at ambient | 1.78 | A | Ambient 40℃ | 3 | |||
| Recommended hold current at ambient | 1.67 | A | Ambient 50℃ | 3 | |||
| Recommended hold current at ambient | 1.5 | A | Ambient 60℃ | 3 | |||
| Recommended hold current at ambient | 1.45 | A | Ambient 70℃ | 3 | |||
| Recommended hold current at ambient | 1.1 | A | Ambient 85℃ | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) | 7 |
CAD (KiCad official)
- Symbol:
SMD1206B200TF - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
smd1206b200tf-etched.step/smd1206b200tf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd1206b200tf.step/smd1206b200tf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Brightking datasheet (8 pp, sha256
1af4fb1e2a72d5a2, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).