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Contents

README

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SMD1206-035-33

hongjiacheng · Resettable Fuses · 1206

SMD1206-035-33 from hongjiacheng, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer hongjiacheng
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum resistance in initial (un-soldered) state (Ri min) Ri min 0.25 Ω Initial un-soldered state 2
Maximum resistance at 25°C one hour after tripping or 260°C/20 s reflow (R1 max) R1 max 1.5 Ω 25°C, measured one hour after tripping or reflow soldering of 260°C for 20 sec 2
Minimum trip current (Itrip) Itrip 0.75 A 25°C still air; minimum current at which the device trips 2
Maximum time-to-trip t_trip 0.1 s Test current 8.0 A; Ta=25°C 2
Hold current (Ihold) Ihold 0.35 A 25°C still air; maximum current device passes without tripping 2
Maximum voltage withstand at rated current (Vmax) Vmax 33 V At rated current Imax 2
Maximum fault current withstand at rated voltage (Imax) Imax 40 A At rated voltage Vmax 2
Typical power dissipated in tripped state (Pd typ) Pd 0.6 W Tripped state, 25°C still air 2
Operating / storage temperature range Top / Tstg -40 85 °C Operating / Storage temperature as printed 4
Maximum device surface temperature in tripped state 125 °C Tripped state 4
Recommended maximum solder paste thickness 0.25 mm Recommended maximum paste thickness 1
Reflow peak temperature (TP) TP 260 °C Printed as +260(+0/-5)°C, Pb-free reflow; do not exceed +260°C 1

CAD (KiCad official)

  • Symbol: SMD1206-035-33
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: smd1206-035-33-etched.step / smd1206-035-33-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd1206-035-33.step / smd1206-035-33.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: hongjiacheng datasheet (6 pp, sha256 ac89288fcdc8403c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF