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Ray Publish 0.1.0 fb5752c 20d ago

SMD0805-020-13.2V

TECHFUSE · Resettable Fuses · 0805

SMD0805-020-13.2V from TECHFUSE, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive First terminal pad of the non-polarized PPTC (tin-plated nickel-copper); rated Vmax 13.2 Vdc, Ihold 0.20 A, Itrip 0.50 A, Imax 100 A.
2 2 passive Second terminal pad of the non-polarized PPTC (tin-plated nickel-copper); interchangeable with the other pad, rated Vmax 13.2 Vdc, Ihold 0.20 A, Itrip 0.50 A, Imax 100 A.

Key specifications

Parameter Value
Manufacturer TECHFUSE
Package 0805
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum operating voltage (rated voltage Vmax) Vmax 13.2 Vdc Without damage at rated current (Imax) 2
Maximum fault current (Imax) Imax 100 A Without damage at rated voltage (Vmax), 25°C 2
Maximum hold current (Ihold) Ihold 0.2 A Maximum current device will not trip, 25°C still air 2
Minimum trip current (Itrip) Itrip 0.5 A Minimum current at which device will always trip, 25°C still air 2
Power dissipation in tripped state (Pd) Pd 0.5 W Tripped state, 25°C still air, at rated voltage 2
Minimum device resistance prior to tripping (Rimin) Rimin 0.65 Ω 25°C 2
Maximum device resistance one hour post reflow (R1max) R1max 3.5 Ω Measured one hour post reflow, 25°C 2
Time to trip 8 s 2
Resistance change after passive aging -5 5 % +85°C, 1000 hrs; printed as ±5% typical 2
Resistance change after humidity aging -5 5 % +85°C, 85% R.H., 168 hours; printed as ±5% typical 2
Resistance change after thermal shock -33 33 % +85°C to -40°C, 20 times; printed as ±33% typical 2
Ambient operating temperature -40 85 °C Ambient operating conditions 2
Maximum surface temperature in tripped state 125 °C Device in tripped state 2
Storage temperature 40 °C Storage conditions 4
Storage relative humidity 70 % R.H. Storage conditions 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin Terminal pad materials: Tin-plated Nickel-Copper 3

CAD (KiCad official)

  • Symbol: SMD0805-020-13.2V
  • Footprint: Fuse:Fuse_0805_2012Metric
  • 3D model: 0805 (KiCad packages3D, STEP)
  • 3D model files: smd0805-020-13-2v-etched.step / smd0805-020-13-2v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd0805-020-13-2v.step / smd0805-020-13-2v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TECHFUSE datasheet (4 pp, sha256 7cc5402437c0abb4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF