# SMD0603B025TF

**Brightking** · Resettable Fuses · 0603

SMD0603B025TF from Brightking, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Brightking |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (maximum current passed without tripping) | Ihold |  |  | 0.25 | A | 23℃ still air | 1 |
| Trip current (minimum current at which device trips) | Itrip | 0.55 |  |  | A | 23℃ still air | 1 |
| Maximum voltage device can withstand without damage | Vmax |  |  | 9 | Vdc | at rated current (Imax) | 1 |
| Maximum fault current device can withstand without damage | Imax |  |  | 40 | A | at rated voltage (Vmax) | 1 |
| Typical power dissipated in tripped state | Pd typ. |  | 0.5 |  | W | tripped state at 23℃ still air | 1 |
| Maximum time to trip |  |  |  | 8 | Sec. | at 0.08 A current | 1 |
| Minimum resistance in initial (un-soldered) state | Rmin | 0.5 |  |  | Ω | initial (un-soldered) state | 1 |
| Maximum resistance at 23℃ | R1max |  |  | 3 | Ω | 23℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec | 1 |
| Operating / storage temperature |  | -40 |  | 85 | ℃ | operating / storage | 5 |
| Maximum device surface temperature in tripped state |  |  |  | 125 | ℃ | tripped state | 5 |
| Passive aging resistance change |  | -50 |  | 50 | % | +85℃, 1000 hours; typical resistance change | 5 |
| Humidity aging resistance change |  | -50 |  | 50 | % | +85℃, 85%R.H., 1000 hours; typical resistance change | 5 |
| Thermal shock resistance change |  | -50 |  |  | % | MIL-STD-202 Method 107G, +85℃/-40℃, 20 times; typical resistance change | 5 |
| Storage temperature (storage condition) |  | 0 |  | 35 | ℃ | ≤70%RH | 4 |
| Peak reflow temperature (TP) | TP |  |  | 260 | ℃ | Pb-free reflow profile; time within 5℃ of peak 20-40 seconds | 4 |
| Recommended hold current at ambient -40℃ |  |  | 0.32 |  | A | Recommended hold current at ambient temperature -40℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient -20℃ |  |  | 0.29 |  | A | Recommended hold current at ambient temperature -20℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 0℃ |  |  | 0.27 |  | A | Recommended hold current at ambient temperature 0℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 23℃ |  |  | 0.25 |  | A | Recommended hold current at ambient temperature 23℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 40℃ |  |  | 0.21 |  | A | Recommended hold current at ambient temperature 40℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 50℃ |  |  | 0.18 |  | A | Recommended hold current at ambient temperature 50℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 60℃ |  |  | 0.16 |  | A | Recommended hold current at ambient temperature 60℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 70℃ |  |  | 0.14 |  | A | Recommended hold current at ambient temperature 70℃ (SMD0603B025TF) | 3 |
| Recommended hold current at ambient 85℃ |  |  | 0.1 |  | A | Recommended hold current at ambient temperature 85℃ (SMD0603B025TF) | 3 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) | 6 |

## CAD (KiCad official)

- Symbol: `SMD0603B025TF`
- Footprint: `Fuse:Fuse_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `smd0603b025tf-etched.step` / `smd0603b025tf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd0603b025tf.step` / `smd0603b025tf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Brightking datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588903004686987264) (7 pp, sha256 `7cdb26eecd7dbfde`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smd0603b025tf-datasheet.pdf)