component
SMD0603B020TF
Public Made by Adomby adom
Brightking Resettable Fuses, 0603. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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SMD0603B020TF
Brightking · Resettable Fuses · 0603
SMD0603B020TF from Brightking, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Brightking |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (max current passed without tripping) | Ihold | 0.2 | A | 23 °C still air, PWB with 0.020in*1.5oz copper traces | 1 | ||
| Trip current (min current that trips the device) | Itrip | 0.5 | A | 23 °C still air | 1 | ||
| Maximum voltage device can withstand without damage | Vmax | 9 | Vdc | at rated current Imax | 1 | ||
| Maximum fault current device can withstand without damage | Imax | 40 | A | at rated voltage Vmax | 1 | ||
| Typical power dissipated in tripped state | Pd typ. | 0.5 | W | tripped state, 23 °C still air | 1 | ||
| Minimum resistance in initial (un-soldered) state | Rmin | 0.55 | Ω | initial un-soldered state | 1 | ||
| Maximum resistance at 23 °C after tripping or reflow | R1max | 3.5 | Ω | 23 °C, measured one hour after tripping or reflow soldering at 260 °C for 20 sec | 1 | ||
| Recommended hold current at ambient -40 °C | 0.27 | A | ambient operation temperature -40 °C | 3 | |||
| Recommended hold current at ambient -20 °C | 0.25 | A | ambient operation temperature -20 °C | 3 | |||
| Recommended hold current at ambient 0 °C | 0.23 | A | ambient operation temperature 0 °C | 3 | |||
| Recommended hold current at ambient 23 °C | 0.2 | A | ambient operation temperature 23 °C | 3 | |||
| Recommended hold current at ambient 40 °C | 0.17 | A | ambient operation temperature 40 °C | 3 | |||
| Recommended hold current at ambient 50 °C | 0.14 | A | ambient operation temperature 50 °C | 3 | |||
| Recommended hold current at ambient 60 °C | 0.12 | A | ambient operation temperature 60 °C | 3 | |||
| Recommended hold current at ambient 70 °C | 0.1 | A | ambient operation temperature 70 °C | 3 | |||
| Recommended hold current at ambient 85 °C | 0.07 | A | ambient operation temperature 85 °C | 3 | |||
| Operating / storage temperature | -40 | 85 | °C | operating / storage | 5 | ||
| Maximum device surface temperature in tripped state | 125 | °C | tripped state | 5 | |||
| Passive aging resistance change (typical) | -50 | 50 | % | +85 °C, 1000 hours, passive aging, typical resistance change | 5 | ||
| Humidity aging resistance change (typical) | -50 | 50 | % | +85 °C, 85% R.H., 1000 hours, typical resistance change | 5 | ||
| Thermal shock resistance change (typical) | -50 | % | MIL-STD-202 Method 107G, -40 / +85 °C, 20 times, typical resistance change | 5 | |||
| Storage temperature (recommended) | 0 | 35 | °C | storage, ≤70% RH | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) | 6 |
CAD (KiCad official)
- Symbol:
SMD0603B020TF - Footprint:
Fuse:Fuse_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
smd0603b020tf-etched.step/smd0603b020tf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd0603b020tf.step/smd0603b020tf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Brightking datasheet (7 pp, sha256
7cdb26eecd7dbfde, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMD0603B020TF
**Brightking** · Resettable Fuses · 0603
SMD0603B020TF from Brightking, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Brightking |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (max current passed without tripping) | Ihold | | | 0.2 | A | 23 °C still air, PWB with 0.020in*1.5oz copper traces | 1 |
| Trip current (min current that trips the device) | Itrip | 0.5 | | | A | 23 °C still air | 1 |
| Maximum voltage device can withstand without damage | Vmax | | | 9 | Vdc | at rated current Imax | 1 |
| Maximum fault current device can withstand without damage | Imax | | | 40 | A | at rated voltage Vmax | 1 |
| Typical power dissipated in tripped state | Pd typ. | | 0.5 | | W | tripped state, 23 °C still air | 1 |
| Minimum resistance in initial (un-soldered) state | Rmin | 0.55 | | | Ω | initial un-soldered state | 1 |
| Maximum resistance at 23 °C after tripping or reflow | R1max | | | 3.5 | Ω | 23 °C, measured one hour after tripping or reflow soldering at 260 °C for 20 sec | 1 |
| Recommended hold current at ambient -40 °C | | | 0.27 | | A | ambient operation temperature -40 °C | 3 |
| Recommended hold current at ambient -20 °C | | | 0.25 | | A | ambient operation temperature -20 °C | 3 |
| Recommended hold current at ambient 0 °C | | | 0.23 | | A | ambient operation temperature 0 °C | 3 |
| Recommended hold current at ambient 23 °C | | | 0.2 | | A | ambient operation temperature 23 °C | 3 |
| Recommended hold current at ambient 40 °C | | | 0.17 | | A | ambient operation temperature 40 °C | 3 |
| Recommended hold current at ambient 50 °C | | | 0.14 | | A | ambient operation temperature 50 °C | 3 |
| Recommended hold current at ambient 60 °C | | | 0.12 | | A | ambient operation temperature 60 °C | 3 |
| Recommended hold current at ambient 70 °C | | | 0.1 | | A | ambient operation temperature 70 °C | 3 |
| Recommended hold current at ambient 85 °C | | | 0.07 | | A | ambient operation temperature 85 °C | 3 |
| Operating / storage temperature | | -40 | | 85 | °C | operating / storage | 5 |
| Maximum device surface temperature in tripped state | | | | 125 | °C | tripped state | 5 |
| Passive aging resistance change (typical) | | -50 | | 50 | % | +85 °C, 1000 hours, passive aging, typical resistance change | 5 |
| Humidity aging resistance change (typical) | | -50 | | 50 | % | +85 °C, 85% R.H., 1000 hours, typical resistance change | 5 |
| Thermal shock resistance change (typical) | | -50 | | | % | MIL-STD-202 Method 107G, -40 / +85 °C, 20 times, typical resistance change | 5 |
| Storage temperature (recommended) | | 0 | | 35 | °C | storage, ≤70% RH | 4 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) | 6 |
## CAD (KiCad official)
- Symbol: `SMD0603B020TF`
- Footprint: `Fuse:Fuse_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `smd0603b020tf-etched.step` / `smd0603b020tf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd0603b020tf.step` / `smd0603b020tf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Brightking datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588903003483492352) (7 pp, sha256 `7cdb26eecd7dbfde`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smd0603b020tf-datasheet.pdf)