# SMD0603-004

**BORN** · Resettable Fuses · 0603

SMD0603-004 from BORN, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal pad of the non-polarized PTC resettable fuse (tin-plated nickel-copper); the SMD0603-004/15N is rated 15 V dc max, 20 A max fault current, 0.04 A hold and 0.12 A trip at 25°C. |
| 2 | 2 | passive | Second terminal pad of the non-polarized PTC resettable fuse (tin-plated nickel-copper); the SMD0603-004/15N is rated 15 V dc max, 20 A max fault current, 0.04 A hold and 0.12 A trip at 25°C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Device resistance prior to tripping (Ri min) | Ri min | 4 |  |  | Ω | 25°C, prior to tripping | 1 |
| Maximum device resistance one hour post reflow | R1max |  |  | 40 | Ω | 25°C, measured one hour post reflow | 1 |
| Maximum operating voltage | V max |  |  | 15 | V dc | at rated current Imax | 1 |
| Maximum fault current | Imax |  |  | 20 | A | at rated voltage V max | 1 |
| Trip current (minimum current that always trips) | I trip | 0.12 |  |  | A | 25°C still air | 1 |
| Ambient operating temperature |  | -40 |  | 85 | °C | ambient operating | 1 |
| Maximum surface temperature in tripped state |  |  |  | 125 | °C | device in tripped state | 1 |
| Resistance change, passive aging |  | -5 |  | 5 | % | +85°C, 1000 hrs; typical | 1 |
| Resistance change, humidity aging |  | -5 |  | 5 | % | +85°C, 85% R.H., 168 hours; typical | 1 |
| Resistance change, thermal shock |  | -33 |  | 33 | % | +85°C to -40°C, 20 times; typical | 1 |
| Average ramp-up rate (Ts max to Tp) |  |  |  | 3 | ℃/second | Pb-free assembly | 3 |
| Ramp-down rate |  |  |  | 6 | ℃/second | Pb-free assembly | 3 |
| Time 25℃ to peak temperature |  |  |  | 8 | minutes | 25℃ to peak temperature | 3 |
| Preheat temperature (Ts min to Ts max) | Ts | 150 |  | 200 | ℃ | Preheat, Pb-free assembly | 3 |
| Preheat time (Ts min to Ts max) |  | 60 |  | 180 | seconds | Preheat, Pb-free assembly | 3 |
| Time maintained above TL | tL | 60 |  | 150 | seconds | above TL 217℃ | 3 |
| Storage temperature |  | 0 |  | 35 | ℃ | storage condition | 3 |
| Storage humidity |  | 30 |  | 60 | %RH | storage condition | 3 |
| Recommended maximum paste thickness |  |  |  | 0.25 | mm | reflow | 3 |
| Hold current (device will not trip, 25°C still air) | I hold |  | 0.04 |  | A | @25°C still air | 1 |
| Power dissipation in tripped state | Pd |  | 0.5 |  | W | tripped state, 25°C still air, at rated voltage | 1 |
| Time to trip |  |  | 1 |  | Sec | at trip current 0.20 A | 1 |
| Peak temperature (Tp) | Tp |  | 260 |  | ℃ | Pb-free reflow profile | 3 |
| Time maintained above TL, liquidus temperature | TL |  | 217 |  | ℃ | Pb-free reflow profile | 3 |
| Recommended hold current at ambient -40°C | I hold |  | 0.052 |  | A | ambient -40°C | 2 |
| Recommended hold current at ambient -20°C | I hold |  | 0.048 |  | A | ambient -20°C | 2 |
| Recommended hold current at ambient 0°C | I hold |  | 0.044 |  | A | ambient 0°C | 2 |
| Recommended hold current at ambient 25°C | I hold |  | 0.04 |  | A | ambient 25°C | 2 |
| Recommended hold current at ambient 40°C | I hold |  | 0.032 |  | A | ambient 40°C | 2 |
| Recommended hold current at ambient 50°C | I hold |  | 0.028 |  | A | ambient 50°C | 2 |
| Recommended hold current at ambient 60°C | I hold |  | 0.024 |  | A | ambient 60°C | 2 |
| Recommended hold current at ambient 70°C | I hold |  | 0.02 |  | A | ambient 70°C | 2 |
| Recommended hold current at ambient 85°C | I hold |  | 0.012 |  | A | ambient 85°C | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 4 |

## CAD (KiCad official)

- Symbol: `SMD0603-004`
- Footprint: `Fuse:Fuse_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `smd0603-004-etched.step` / `smd0603-004-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smd0603-004.step` / `smd0603-004.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BORN datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590172740566491136) (5 pp, sha256 `aba1db431db69e76`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smd0603-004-datasheet.pdf)