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Ray Publish 0.1.0 4cef3ec 8d ago

SMD0402P020SLR

PTTC Polytronics Tech · Resettable Fuses · 0402

SMD0402P020SLR from PTTC Polytronics Tech, in a 0402. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer PTTC Polytronics Tech
Package 0402
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Hold current (maximum current without tripping) Ihold 0.2 A 23 ºC still air 2
Trip current (minimum current at which device trips) Itrip 0.5 A 23 ºC still air 2
Maximum voltage device can withstand without damage Vmax 6 Vdc at rated current (Imax) 2
Maximum fault current device can withstand without damage Imax 40 A at rated voltage (Vmax) 2
Minimum resistance in initial (un-soldered) state Rmin 0.1 Ω initial un-soldered state 2
Maximum resistance at 23 ºC after tripping or reflow R1max 1.25 Ω 23 ºC, measured one hour after tripping or reflow soldering at 260 ºC for 20 sec 2
Maximum time to trip 1 s at 1.00 A (Maximum Time To Trip Current column) 2
Typical power dissipated in tripped state Pd 0.5 W tripped state, 23 ºC still air 2
Operating temperature -40 85 ºC 7
Maximum device surface temperature in tripped state 125 ºC tripped state 7
Resistance change after thermal shock -30 % MIL-STD-202 Method 107G, +85 ºC/-40 ºC, 20 times 7
Recommended hold current at ambient temperature 0.29 A ambient -40 ºC 4
Recommended hold current at ambient temperature 0.09 A ambient 85 ºC 4
Storage temperature 0 35 ºC storage, 70%RH 5
Preheat time (Tsmin to Tsmax) 60 180 s Tsmin 150 ºC to Tsmax 200 ºC 5
Average ramp-up rate (Tsmax to TP) 3 ºC/s Pb-free assembly 5
Time maintained above TL tL 60 150 s above TL = 217 ºC 5
Peak temperature TP 260 ºC Pb-free reflow profile, topside of package 5
Time within 5 ºC of actual peak temperature tP 20 40 s within 5 ºC of actual peak temperature 5
Ramp-down rate 6 ºC/s from peak temperature 5
Time from 25 ºC to peak temperature 8 min 25 ºC to peak temperature 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) 8

CAD (KiCad official)

  • Symbol: SMD0402P020SLR
  • Footprint: Fuse:Fuse_0402_1005Metric
  • 3D model: 0402 (KiCad packages3D, STEP)
  • 3D model files: smd0402p020slr-etched.step / smd0402p020slr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smd0402p020slr.step / smd0402p020slr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: PTTC Polytronics Tech datasheet (10 pp, sha256 b69574d6d0d75a1b, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF