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Ray Publish 0.1.0 2a3db07 16d ago

SMCJ70AX

Shenzhen JingYang · ESD And Surge Protection (TVS/ESD) · SMC

SMCJ70AX from Shenzhen JingYang, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation.
2 2 passive Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation.

Key specifications

Parameter Value
Manufacturer Shenzhen JingYang
Package SMC
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power Dissipation (10/1000 us waveform) PPPM 1500 W 10/1000 us waveform (Note 1, 2, FIG.1); printed as 'Min 1500' 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Peak Forward Surge Current IFSM 200 Amps 8.3ms single half sine-wave superimposed on rated load, JEDEC method (Note 2, 3) 1
Breakdown Voltage MIN (unidirectional SMCJ70A) VBR MIN 77.8 V @ IT 1.0 mA 3
Breakdown Voltage MAX (unidirectional SMCJ70A) VBR MAX 89.5 V @ IT 1.0 mA 3
Maximum Clamping Voltage (unidirectional SMCJ70A) VC 113 V @ IPP 13.3 A 3
Reverse Leakage (unidirectional SMCJ70A) IR 5 uA @ VRMW 70 V 3
Reverse Stand-Off Voltage (unidirectional SMCJ70A) VRWM 70 V 3
Time from 25°C to peak temperature t 8 minutes Lead-free assembly reflow profile 7
Peak Temperature TP 260 °C Lead-free assembly reflow; do not exceed 260°C 7
Time within 5°C of actual peak temperature tp 20 40 secs Lead-free assembly reflow profile 7
Ramp-down Rate 6 °C/second Lead-free assembly reflow profile, from peak 7
Average ramp-up rate (liquidus temp to peak) 3 °C/second Lead-free assembly reflow profile 7
TS(max) to TL ramp-up rate 3 °C/second Lead-free assembly reflow profile 7
Time above liquidus (tL) tL 60 150 secs Liquidus temperature TL 217°C, lead-free assembly 7
Preheat Temperature Min Ts(min) 150 °C Lead-free assembly reflow profile 7
Preheat Temperature Max Ts(max) 200 °C Lead-free assembly reflow profile 7
Preheat Time (min to max) ts 60 180 secs Lead-free assembly reflow profile 7

CAD (KiCad official)

  • Symbol: SMCJ70AX
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: smcj70ax-etched.step / smcj70ax-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smcj70ax.step / smcj70ax.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JingYang datasheet (7 pp, sha256 5c412a4808aba271, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF