# SMCJ13A-L

**Shandong Jingdao Microelectronics** · ESD And Surge Protection (TVS/ESD) · SMC

SMCJ13A-L from Shandong Jingdao Microelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the unidirectional TVS diode (for bipolar types the terminal is interchangeable); SMCJ13A-L has 13 V stand-off voltage, 14.4-15.9 V breakdown at 1 mA and 21.5 V max clamping at 28 A. |
| 2 | Anode | passive | Anode of the unidirectional TVS diode; SMCJ13A-L has 13 V stand-off voltage, 14.4-15.9 V breakdown and 21.5 V max clamping voltage at 28 A peak pulse current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SMC |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM |  | 13 |  | V | Ta = 25°C | 2 |
| Breakdown voltage | VBR | 14.4 |  | 15.9 | V | @ IT = 1 mA, Ta = 25°C | 2 |
| Maximum clamping voltage | VC |  |  | 21.5 | V | @ IPP = 28.0 A | 2 |
| Peak pulse current | IPP |  |  | 28 | A | 10/1000 us waveform | 2 |
| Maximum reverse leakage | IR |  |  | 1 | µA | @ VRWM | 2 |
| Maximum instantaneous forward voltage | VF |  |  | 3.5 | V | at 100 A, unidirectional only | 1 |
| Peak pulse power dissipation | PPPM |  |  | 600 | W | 10/1000 us waveform | 1 |
| Peak forward surge current | IFSM |  |  | 100 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method), UNI | 1 |
| Operating junction and storage temperature range | Tj, Tstg | -55 |  | 150 | °C |  | 1 |
| Thermal resistance junction to ambient | RθJA |  | 75 |  | °C/W | Note 1 | 1 |
| Thermal resistance junction to lead | RθJL |  | 15 |  | °C/W | Note 1 | 1 |

## CAD (KiCad official)

- Symbol: `SMCJ13A-L`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC (KiCad packages3D, STEP)
- 3D model files: `smcj13a-l-etched.step` / `smcj13a-l-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smcj13a-l.step` / `smcj13a-l.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](docs/smcj13a-l-datasheet.pdf) (4 pp, sha256 `fe884aa643fb34c4`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smcj13a-l-datasheet.pdf)