# SMBJP6KE91AHE3-TP

**MCC(Micro Commercial Components)** · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)

SMBJP6KE91AHE3-TP from MCC(Micro Commercial Components), in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the unidirectional 600W TVS (marked by the color band, positive end), 91A device with 77.8-95.5V breakdown at 1mA and 125.0V max clamping at 4.9A IPP. |
| 2 | Anode | passive | Anode of the unidirectional TVS, the end opposite the cathode color band. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | V(BR) | 86.5 |  | 95.5 | V | @ IT = 1 mA | 2 |
| Maximum Clamping Voltage | VC |  |  | 125 | V | @ IPP | 2 |
| Peak Pulse Current | IPP |  |  | 4.9 | A | 10/1000μs waveform | 2 |
| Maximum Reverse Leakage | ID |  |  | 1 | μA | @ VWM | 2 |
| Test Current | IT |  | 1 |  | mA | V(BR) test current | 2 |
| Peak Pulse Power Dissipation | PPP |  |  | 600 | W | 10/1000μs waveform, non-repetitive, Note 3 | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 175 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 175 | °C |  | 1 |
| Maximum Soldering Temperature |  |  |  | 260 | °C | 10 seconds | 1 |
| Reverse Stand-Off Voltage | VWM |  | 77.8 |  | V |  | 2 |
| Thermal Resistance Junction to Lead | RθJL |  | 20 |  | °C/W | Junction to Lead | 1 |
| Thermal Resistance Junction to Case | RθJC |  | 25 |  | °C/W | Junction to Case | 1 |

## CAD (KiCad official)

- Symbol: `SMBJP6KE91AHE3-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `smbjp6ke91ahe3-tp-etched.step` / `smbjp6ke91ahe3-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbjp6ke91ahe3-tp.step` / `smbjp6ke91ahe3-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/smbjp6ke91ahe3-tp-datasheet.pdf) (5 pp, sha256 `a511f3eea478b0d0`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smbjp6ke91ahe3-tp-datasheet.pdf)