# SMBJP6KE82A-TP

**MCC(Micro Commercial Components)** · TVS · SMB(DO-214AA)

SMBJP6KE82A-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode (color-band end, positive) of the unidirectional SMBJP6KE82A, with 70.1 V reverse stand-off, 77.9-86.1 V breakdown at 1 mA and 113 V maximum clamping at 5.4 A peak pulse current. |
| 2 | Anode | passive | Anode of the unidirectional SMBJP6KE82A, normally connected to the lower-potential (ground) side of the protected line. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | V(BR) | 77.9 |  | 86.1 | V | @ IT = 1 mA | 2 |
| Reverse Stand-Off Voltage | VWM | 70.1 |  |  | V |  | 2 |
| Maximum Clamping Voltage | VC |  |  | 113 | V | @ IPP | 2 |
| Peak Pulse Current | IPP |  |  | 5.4 | A |  | 2 |
| Maximum Reverse Leakage | ID |  |  | 1 | μA | @ VWM | 2 |
| Peak Pulse Power Dissipation | PPP |  |  | 600 | W | Note 2, 10/1000μs waveform | 1 |
| Operating Junction Temperature Range | TJ | -65 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -65 |  | 150 | °C |  | 1 |
| Thermal Resistance Junction to Lead | RθJL |  | 20 |  | °C/W | Junction to Lead | 1 |
| Thermal Resistance Junction to Case | RθJC |  | 25 |  | °C/W | Junction to Case | 1 |
| Maximum Soldering Temperature |  |  |  | 260 | °C | 10 Seconds | 1 |
| Response Time |  |  | 1 |  | ps | Typical less than 1ps from 0V to VBR min | 1 |

## CAD (KiCad official)

- Symbol: `SMBJP6KE82A-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `smbjp6ke82a-tp-etched.step` / `smbjp6ke82a-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbjp6ke82a-tp.step` / `smbjp6ke82a-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/smbjp6ke82a-tp-datasheet.pdf) (5 pp, sha256 `75ba3f24bb91d1fe`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smbjp6ke82a-tp-datasheet.pdf)