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SMBJ9.0A-TP

MCC(Micro Commercial Components) · TVS · SMB(DO-214AA)

SMBJ9.0A-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode (color band/cathode mark denotes the positive end) of the unidirectional SMBJ9.0A TVS, with VWM 9.0V, breakdown 10.0-11.1V at 1mA and maximum clamping voltage 15.4V at 39.0A IPP.
2 Anode passive Anode of the unidirectional SMBJ9.0A TVS, which is the negative end opposite the color band, for a 600W peak pulse power device.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SMB(DO-214AA)
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Stand-Off Voltage VWM 9 V SMBJ9.0A 2
Breakdown Voltage V(BR) 10 11.1 V @ IT = 1 mA 2
Maximum Clamping Voltage VC 15.4 V @ IPP 2
Peak Pulse Current IPP 39 A 10/1000us waveform 2
Maximum Reverse Leakage ID 5 μA @ VWM 2
Peak Pulse Power Dissipation PPP 600 W Note 3,4,5; 10/1000us 1
Steady State Power Dissipation PM(AV) 5 W Note 6, TL=75°C 1
Peak Forward Surge Current IFSM 100 A 8.3 ms single half sine-wave, unidirectional only 1
Operating Junction Temperature TJ -55 175 °C 1
Storage Temperature Tstg -55 175 °C 1
Maximum Soldering Temperature 260 °C 10 seconds 1
Thermal Resistance Junction to Lead RθJL 20 °C/W 1
Thermal Resistance Junction to Case RθJC 25 °C/W 1
Thermal Resistance Junction to Ambient RθJA 100 °C/W 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper copper pads to each terminal. 1

CAD (KiCad official)

  • Symbol: SMBJ9.0A-TP
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj9-0a-tp-etched.step / smbj9-0a-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj9-0a-tp.step / smbj9-0a-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (8 pp, sha256 1ca35cb67d5eb058, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF