# SMBJ85CA

**BORN** · TVS · DO-214AA(SMB)

SMBJ85CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (bidirectional SMBJ85CA) | VBR | 94.4 |  | 104 | V | @ IT = 1 mA | 4 |
| Maximum clamping voltage (bidirectional SMBJ85CA) | VC |  |  | 137 | V | @ Ipp = 4.4 A | 4 |
| Maximum peak pulse current (bidirectional SMBJ85CA) | Ipp |  |  | 4.4 | A |  | 4 |
| Maximum reverse leakage current (bidirectional SMBJ85CA) | IR |  |  | 1 | uA | @ VR = 85 V | 4 |
| Reverse stand-off voltage (bidirectional SMBJ85CA) | VR |  |  | 85 | V | Peak off-state voltage; table column Reverse Stand-Off Voltage | 4 |
| Peak pulse power dissipation | PPPM |  |  | 600 | W | Non-repetitive 10/1000us waveform (Note 1,2); mounted on copper pad 5x5mm to each terminal | 2 |
| Steady state power dissipation | PD |  |  | 5 | W | Infinite heatsink at TA = 50°C (Note 3) | 2 |
| Peak forward surge current | IFSM |  |  | 100 | A | 8.3ms single half sine wave or equivalent square wave (Note 4) | 2 |
| Operating temperature range | TJ | -55 |  | 150 | °C |  | 2 |
| Storage temperature range | TSTG | -55 |  | 150 | °C |  | 2 |
| Typical thermal resistance junction to lead | RθJL |  | 20 |  | °C/W | Typical | 2 |
| Typical thermal resistance junction to ambient | RθJA |  | 100 |  | °C/W | Typical | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |

## CAD (KiCad official)

- Symbol: `SMBJ85CA`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `smbj85ca-etched.step` / `smbj85ca-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj85ca.step` / `smbj85ca.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BORN datasheet](docs/smbj85ca-datasheet.pdf) (7 pp, sha256 `714b9a8b6a4ec525`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smbj85ca-datasheet.pdf)