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Contents

README

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SMBJ8.5A

FTR · TVS · DO-214AA(SMB)

SMBJ8.5A from FTR, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer FTR
Package DO-214AA(SMB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse stand-off voltage (unidirectional SMBJ8.5A) VRWM 8.5 V 2
Breakdown voltage VBR 9.4 10.4 V IT = 1 mA 2
Maximum clamping voltage VC 14.4 V IPP = 41.7 A 2
Reverse leakage current IR 10 μA @VRWM 2
Peak pulse power dissipation PPPM 600 W 10/1000μs waveform (Note 1, Fig.1) 1
Peak pulse current IPPM 41.7 A 10/1000μs waveform (Note 1, Fig.3); value from IPP column for SMBJ8.5A 1
Steady state power dissipation PM(AV) 5 W TL=75℃ (Fig.4) 1
Peak forward surge current IFSM 100 A 8.3ms single half sine-wave, JEDEC method (Note 2) 1
Operating junction and storage temperature range TJ,TSTG -55 150 ℃ 1
Thermal resistance junction to lead RθJL 20 ℃/W Typical 1
Thermal resistance junction to ambient RθJA 100 ℃/W Typical 1
Average ramp-up rate (TL to TP) 3 ℃/second Pb-free assembly reflow profile 4
Preheat temperature min TS min 150 ℃ Pb-free assembly reflow profile 4
Preheat temperature max TS max 200 ℃ Pb-free assembly reflow profile 4
Preheat time tS 60 180 seconds Preheat, min to max 4
Ramp-up rate (TS max to TL) 3 ℃/second Pb-free assembly reflow profile 4
Time maintained above liquidus temperature tL 60 150 seconds Time above TL = 217℃ 4
Liquidus temperature TL 217 ℃ Time maintained above TL 4
Peak temperature TP 260 ℃ Pb-free assembly reflow profile 4
Time within 5℃ of actual peak temperature tP 20 40 seconds Within 5℃ of actual peak temperature 4
Ramp-down rate 6 ℃/second Pb-free assembly reflow profile 4
Time 25℃ to peak temperature 8 minutes Pb-free assembly reflow profile 4

CAD (KiCad official)

  • Symbol: SMBJ8.5A
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: smbj8-5a-etched.step / smbj8-5a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj8-5a.step / smbj8-5a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FTR datasheet (6 pp, sha256 0d5134e86f94d39e, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF