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SMBJ75CA

Shandong Jingdao Microelectronics · TVS · SMB

SMBJ75CA from Shandong Jingdao Microelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Pin 1 is listed as Cathode in the PINNING table, which the datasheet gives for the unipolar device; the text does not state a separate function for this pin on the bipolar (CA-suffix) SMBJ75CA.
2 Anode passive Pin 2 is listed as Anode in the PINNING table, which the datasheet gives for the unipolar device; the text does not state a separate function for this pin on the bipolar (CA-suffix) SMBJ75CA.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMB
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power Dissipation on 10/1000 us waveform PPPM 600 W 10/1000 us waveform (Note1, Note2, Fig.1) 1
Peak Forward Surge Current, 8.3 ms single half sine-wave IFSM 100 A 8.3 ms single half sine-wave, JEDEC method (Note 3, Fig 4) 1
Operating Junction and Storage Temperature Range Tj, Tstg -65 150 °C 1
ESD Voltage per IEC61000-4-2, Contact VESD1 30 kV Contact, per IEC61000-4-2 1
ESD Voltage per IEC61000-4-2, Air VESD2 30 kV Air, per IEC61000-4-2 1
Typical Thermal Resistance Junction to Ambient RθJA 100 °C/W Mounted on 5 mm (0.13 mm thick) land areas (Note 2) 1
Reverse Stand-off Voltage VRMW 75 V 2
Breakdown Voltage, minimum VBR 83.3 V Test current IT = 1 mA, Ta = 25°C 2
Breakdown Voltage, maximum VBR 92.1 V Test current IT = 1 mA, Ta = 25°C 2
Reverse Leakage Current 1 μA Ta = 25°C 2
Max. Clamp Voltage VC 121 V @ IPP, Ta = 25°C 2
Peak Pulse Current IPP 5 A 10/1000 us waveform (Note 1, Fig 3), Ta = 25°C 2
Typical Junction Capacitance CJ 390 pF VR = 4 V, f = 1 MHz 1

CAD (KiCad official)

  • Symbol: SMBJ75CA
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: smbj75ca-etched.step / smbj75ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj75ca.step / smbj75ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (4 pp, sha256 11a0cb29fa635344, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF