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SMBJ70CA

Shandong Jingdao Microelectronics · ESD And Surge Protection (TVS/ESD) · SMB

SMBJ70CA from Shandong Jingdao Microelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Pin 1 is labelled Cathode in the PINNING table for the unipolar part; the datasheet gives no polarity designation for pin 1 on the bipolar (CA) variant, so it is shown only as a numbered terminal of the bidirectional symbol.
2 Anode passive Pin 2 is labelled Anode in the PINNING table for the unipolar part; the datasheet gives no polarity designation for pin 2 on the bipolar (CA) variant, so it is shown only as a numbered terminal of the bidirectional symbol.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMB
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power Dissipation (10/1000 us waveform) PPPM 600 W 10/1000 us waveform (Note1, Note2, Fig.1) 1
Peak Forward Surge Current IFSM 100 A 8.3ms single half sine-wave, JEDEC method (Note 3, Fig 4) 1
Reverse Stand-off Voltage VRMW 70 V 2
Breakdown Voltage VBR 77.8 86 V @ IT = 1 mA 2
Reverse Leakage Current 1 μA 2
Max. Clamp Voltage VC 113 V @ IPP = 5.3 A 2
Peak Pulse Current IPP 5.3 A Table 1, 10/1000 us waveform 2
Typical Junction Capacitance CJ 390 pF VR=4V, f=1MHz 1
ESD Voltage per IEC6100-4-2, Contact VESD1 30 kV Contact, per IEC6100-4-2 1
ESD Voltage per IEC6100-4-2, Air VESD2 30 kV Air, per IEC6100-4-2 1
Typical Thermal Resistance Junction to Ambient RθJA 100 °C/W Note 2: mounted on 5 mm (0.13mm thick) land areas 1
Operating Junction and Storage Temperature Range Tj, Tstg -65 150 °C 1

CAD (KiCad official)

  • Symbol: SMBJ70CA
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: smbj70ca-etched.step / smbj70ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj70ca.step / smbj70ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (4 pp, sha256 3645fe149a846541, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF