# SMBJ64CA-TP

**MCC(Micro Commercial Components)** · TVS · SMB(DO-214AA)

SMBJ64CA-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (bidirectional, 5%) | V(BR) | 71.1 |  | 78.6 | VOLTS | @ IT 1 mA | 5 |
| Maximum clamping voltage |  |  |  | 103 | VOLTS | @ IPP 5.8 A | 5 |
| Maximum reverse leakage current | ID |  |  | 1 | μA | @ VWM | 5 |
| Peak pulse power dissipation | PPP |  |  | 600 | W | 10/1000μs waveform, Note 2,3,4 | 1 |
| Steady state power dissipation | PM(AV) |  |  | 5 | W | Note 5 | 1 |
| Peak pulse surge current | IPP |  |  | 5.8 | A | 10/1000μs waveform, see table note 2 | 5 |
| Operating junction temperature range |  | -55 |  | 175 | °C |  | 1 |
| Storage temperature range |  | -55 |  | 175 | °C |  | 1 |
| Thermal resistance junction to lead |  |  |  | 20 | °C/W | junction to lead | 1 |
| Thermal resistance junction to case |  |  |  | 25 | °C/W | junction to case | 1 |
| Maximum soldering temperature |  |  |  | 260 | °C | for 10 seconds | 1 |
| Reverse stand-off voltage | VWM |  | 64 |  | VOLTS |  | 5 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | copper pads to each terminal. | 1 |

## CAD (KiCad official)

- Symbol: `SMBJ64CA-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `smbj64ca-tp-etched.step` / `smbj64ca-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj64ca-tp.step` / `smbj64ca-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/smbj64ca-tp-datasheet.pdf) (8 pp, sha256 `01214abe0af87258`, retrieved 2026-10-28, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smbj64ca-tp-datasheet.pdf)