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SMBJ6.5D-M3

Vishay Intertech · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)

SMBJ6.5D-M3 from Vishay Intertech, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage (min) VBR 7.33 V At IT = 10 mA; pulse test tp ≤ 50 ms (note 1) 2
Breakdown voltage (max) VBR 7.87 V At IT = 10 mA; pulse test tp ≤ 50 ms (note 1) 2
Maximum reverse leakage ID 300 μA At VWM 2
Maximum peak pulse surge current IPPM 54.5 A Surge current waveform per fig. 3 and derate per fig. 2 (note 3) 2
Maximum clamping voltage VC 11 V At IPPM 2
Peak pulse power dissipation PPPM 600 W 10/1000 μs waveform; non-repetitive, per fig. 3 and derated above TA = 25 °C per fig. 2 (note 1) 1
Power dissipation at TM PD 5 W TM = 50 °C; mounted on infinite heatsink (note 2) 1
Power dissipation at TA PD 1 W TA = 25 °C; mounted on minimum recommended pad layout (note 3) 1
Operating junction and storage temperature (min) TJ, TSTG -55 °C 1
Operating junction and storage temperature (max) TJ, TSTG 150 °C 1
Typical thermal resistance, junction to ambient (minimum pad) RθJA 125 °C/W Mounted on minimum recommended pad layout (note 1) 3
Typical thermal resistance, junction to ambient (5.0 mm x 5.0 mm copper pad) RθJA 100 °C/W Mounted on 5.0 mm x 5.0 mm copper pad area (note 2) 3
Typical thermal resistance, junction to mount RθJM 20 °C/W 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 1

CAD (KiCad official)

  • Symbol: SMBJ6.5D-M3
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj6-5d-m3-etched.step / smbj6-5d-m3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj6-5d-m3.step / smbj6-5d-m3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 c1e92b4c130e4dc1, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF