component
SMBJ6.5CA R5G
Public Made by Adomby adom
Taiwan Semiconductor TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMBJ6.5CA R5G
Taiwan Semiconductor · TVS · DO-214AA(SMB)
SMBJ6.5CA R5G from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | DO-214AA(SMB) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 7.22 | V | IT = 10 mA | 2 | ||
| Breakdown voltage (max) | VBR | 7.98 | V | IT = 10 mA | 2 | ||
| Maximum blocking leakage current | ID | 500 | µA | @ VWM | 2 | ||
| Maximum peak impulse current | IPP | 56 | A | Note 2: surge waveform per Fig.3 | 2 | ||
| Maximum clamping voltage | VC | 11.2 | V | @ IPP | 2 | ||
| Non-repetitive peak impulse power dissipation | PPK | 600 | W | 10/1000µs waveform | 1 | ||
| Steady state power dissipation | PD | 3 | W | TA = 25°C | 1 | ||
| Peak forward surge current | IFSM | 100 | A | 8.3ms single half sine-wave superimposed on rated load, uni-directional only | 1 | ||
| Forward voltage | VF | 3.5 | V | IF = 50A, uni-directional only | 1 | ||
| Junction temperature | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | °C | 1 | ||
| Junction-to-case thermal resistance | RӨJC | 10 | °C/W | 2 | |||
| Junction-to-ambient thermal resistance | RӨJA | 55 | °C/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test | 1 |
CAD (KiCad official)
- Symbol:
SMBJ6.5CA R5G - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
smbj6-5ca-r5g-etched.step/smbj6-5ca-r5g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj6-5ca-r5g.step/smbj6-5ca-r5g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (8 pp, sha256
6b1cb45d62a964cc, retrieved 2026-10-24, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).