Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SMBJ6.5CA M4G

Taiwan Semiconductor · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)

SMBJ6.5CA M4G from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package DO-214AA(SMB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage, min (SMBJ6.5A row) VBR 7.22 V IT = 10 mA; Note 1: VBR measured after IT applied for 30 ms 2
Breakdown voltage, max (SMBJ6.5A row) VBR 7.98 V IT = 10 mA; Note 1: VBR measured after IT applied for 30 ms 2
Maximum blocking leakage current (SMBJ6.5A row) ID 500 µA @VWM = 6.5 V; Note 5: ID limit doubled for bipolar types with VWM of 10 V and under 2
Maximum peak impulse current (SMBJ6.5A row) IPP 56 A Note 2: surge waveform per Fig.3, derate per Fig.2 2
Maximum clamping voltage (SMBJ6.5A row) VC 11.2 V @IPP 2
Non-repetitive peak impulse power dissipation PPK 600 W 10/1000µs waveform (Note 1) 1
Steady state power dissipation PD 3 W TA = 25°C 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction-to-case thermal resistance RӨJC 10 °C/W 2
Junction-to-ambient thermal resistance RӨJA 55 °C/W 2

CAD (KiCad official)

  • Symbol: SMBJ6.5CA M4G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: smbj6-5ca-m4g-etched.step / smbj6-5ca-m4g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj6-5ca-m4g.step / smbj6-5ca-m4g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (8 pp, sha256 6b1cb45d62a964cc, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF