# SMBJ5340BE3

**Microchip Tech** · Zener Diodes · SMBJ(DO-214AA)

SMBJ5340BE3 from Microchip Tech, in a SMBJ(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, indicated by the band; the diode is operated with the banded end positive with respect to the opposite end (Zener breakdown operation). |
| 2 | A | passive | Anode, the end opposite the cathode band, which is negative with respect to the banded end in normal Zener operation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SMBJ(DO-214AA) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener Voltage tolerance (B suffix) | VZ | -5 |  | 5 | % | Breakdown voltage tolerance B = +/- 5% | 2 |
| Junction and Storage Temperature | TJ and TSTG | -65 |  | 150 | °C |  | 1 |
| Off-State Power Dissipation | PD |  |  | 5 | W | @ 25 °C | 1 |
| Forward Voltage | VF |  |  | 1.2 | V | @ 1.0 A | 1 |
| Solder Temperature | TSP |  |  | 260 | °C | @ 10 s | 1 |
| Thermal Resistance Junction-to-Lead | RӨJL |  |  | 25 | °C/W |  | 1 |
| Thermal Resistance Junction-to-Ambient | RӨJA |  |  | 90 | °C/W | Mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 |
| Maximum Dynamic Impedance | ZZ |  |  | 1 | Ohms | @ IZT | 3 |
| Maximum Reverse Current | IR |  |  | 1 | µA | TL = 30 °C; at VR | 3 |
| IR Test Voltage (B suffix) | VR |  |  | 3 | V | B & C suffix only | 3 |
| Maximum Regulator Current | IZM |  |  | 790 | mA | B & C suffix only | 3 |
| Maximum Dynamic Knee Impedance | ZZK |  |  | 300 | Ohms | @ 1.0 mA | 3 |
| Maximum Surge Current | IZSM |  |  | 12.7 | Amps | Non-recurrent half-sine wave, 8.3 ms | 3 |
| Regulator Voltage (nominal) | VZ |  | 6 |  | V | TL = 30 °C; measured at IZT | 3 |
| Test Current | IZT |  | 200 |  | mA |  | 3 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • TERMINALS: C-bend (modified J-bend) tin-lead or RoHS compliant annealed matte-tin plating solderable per MIL-STD-750, method 2026. | 2 |

## CAD (KiCad official)

- Symbol: `SMBJ5340BE3`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMBJ(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `smbj5340be3-etched.step` / `smbj5340be3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj5340be3.step` / `smbj5340be3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microchip Tech datasheet](docs/smbj5340be3-datasheet.pdf) (5 pp, sha256 `c3c70f99c17b211f`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smbj5340be3-datasheet.pdf)