main
History Download
Ray Publish 0.1.0 8c1f962 6d ago

SMBJ5340B-TP

MCC(Micro Commercial Components) · Zener Diodes · SMB(DO-214AA)

SMBJ5340B-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode (marked with the cathode band); the 6 V ±5% zener voltage is regulated at IZT = 200 mA with ZZT max 1 ohm, IR max 1 µA at VR = 3 V, and IZM max 790 mA.
2 A passive Anode; forward voltage VF is 1.2 V max at 1.0 A, and steady-state power dissipation is 5 W with lead temperature at 75°C.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage tolerance VZ -5 5 % Devices listed have ±5% tolerance on nominal VZ 3
Maximum dynamic impedance ZZT 1 Ω IZT = 200 mA 2
Maximum reverse current IR 1 µA VR = 3 V 2
Maximum regulator current IZM 790 mA 2
Maximum dynamic knee impedance ZZK 300 Ω IZK = 1.0 mA 2
Maximum surge current IZSM 12.7 A 8.3 ms nonrecurring sine wave 2
Maximum voltage regulation ΔVZ 0.19 V Difference between voltage at 10% and 50% IZM 2
Forward voltage VF 1.2 V IF = 1.0 A 1
Steady state power dissipation P(AV) 5 W TL = 75°C, derate linearly to zero at 150°C 1
Operating and storage temperature TJ, TSTG -55 150 °C 1
Thermal resistance junction to lead RθJL 15 °C/W 1
Thermal resistance junction to ambient RθJA 90 °C/W 1
Nominal zener voltage VZ 6 V IZT = 200 mA 2
Zener test current IZT 200 mA 2
Maximum soldering temperature 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: SMBJ5340B-TP
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj5340b-tp-etched.step / smbj5340b-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj5340b-tp.step / smbj5340b-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (5 pp, sha256 64cba779e9296de3, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF