component
SMBJ33CAJ
Public Made by Adomby adom
WeEn Semiconductors ESD And Surge Protection (TVS/ESD), SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMBJ33CAJ
WeEn Semiconductors · ESD And Surge Protection (TVS/ESD) · SMB
SMBJ33CAJ from WeEn Semiconductors, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WeEn Semiconductors |
| Package | SMB |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power | PPPM | 600 | W | 10/1000 μs waveform, footnote [1] (IEC 61643-321) | 1 | ||
| Steady state power dissipation | PM(AV) | 5 | W | on infinite heatsink at Ta = 50 °C | 1 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 1 | ||
| Operating temperature range | Tj | -65 | 150 | °C | 1 | ||
| Breakdown voltage (SMBJ33CA, bi-directional) | VBR | 36.98 | 40.3 | V | IT = 1 mA | 2 | |
| Max. clamping voltage (SMBJ33CA, bi-directional) | VC | 53.3 | V | @ Ipp | 2 | ||
| Max. peak pulse current (SMBJ33CA, bi-directional) | Ipp | 11.3 | A | 2 | |||
| Maximum reverse leakage (SMBJ33CA, bi-directional) | IR | 1 | μA | @ VR | 2 |
CAD (KiCad official)
- Symbol:
SMBJ33CAJ - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
smbj33caj-etched.step/smbj33caj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj33caj.step/smbj33caj.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WeEn Semiconductors datasheet (7 pp, sha256
66a83a6e59c74b99, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).