component
SMBJ30CAH
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Taiwan Semiconductor TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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SMBJ30CAH
Taiwan Semiconductor · TVS · DO-214AA(SMB)
SMBJ30CAH from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | DO-214AA(SMB) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (bidirectional, SMBJ30AH row) | VBR | 33.3 | 36.8 | V | IT = 1 mA (Note 1: measured after IT applied for 30 ms) | 3 | |
| Maximum blocking leakage current | ID | 1 | µA | @ VWM = 30 V | 3 | ||
| Maximum peak impulse current | IPP | 13 | A | Note 2: surge waveform per Fig. 3, derate per Fig. 2 | 3 | ||
| Maximum clamping voltage | VC | 48.4 | V | @ IPP = 13.0 A | 3 | ||
| Non-repetitive peak impulse power dissipation | PPK | 600 | W | 10/1000 µs waveform (Note 1: derated above TA = 25°C per Fig. 2) | 1 | ||
| Steady state power dissipation | PD | 3 | W | TA = 25°C | 1 | ||
| Junction temperature | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | °C | 1 | ||
| Junction-to-case thermal resistance | RӨJC | 10 | °C/W | 2 | |||
| Junction-to-ambient thermal resistance | RӨJA | 55 | °C/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test | 1 |
CAD (KiCad official)
- Symbol:
SMBJ30CAH - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
smbj30cah-etched.step/smbj30cah-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj30cah.step/smbj30cah.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (8 pp, sha256
1fcb5bfd7d31a686, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ30CAH
**Taiwan Semiconductor** · TVS · DO-214AA(SMB)
SMBJ30CAH from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | DO-214AA(SMB) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (bidirectional, SMBJ30AH row) | VBR | 33.3 | | 36.8 | V | IT = 1 mA (Note 1: measured after IT applied for 30 ms) | 3 |
| Maximum blocking leakage current | ID | | | 1 | µA | @ VWM = 30 V | 3 |
| Maximum peak impulse current | IPP | | | 13 | A | Note 2: surge waveform per Fig. 3, derate per Fig. 2 | 3 |
| Maximum clamping voltage | VC | | | 48.4 | V | @ IPP = 13.0 A | 3 |
| Non-repetitive peak impulse power dissipation | PPK | | | 600 | W | 10/1000 µs waveform (Note 1: derated above TA = 25°C per Fig. 2) | 1 |
| Steady state power dissipation | PD | | | 3 | W | TA = 25°C | 1 |
| Junction temperature | TJ | -55 | | 150 | °C | | 1 |
| Storage temperature | TSTG | -55 | | 150 | °C | | 1 |
| Junction-to-case thermal resistance | RӨJC | | 10 | | °C/W | | 2 |
| Junction-to-ambient thermal resistance | RӨJA | | 55 | | °C/W | | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test | 1 |
## CAD (KiCad official)
- Symbol: `SMBJ30CAH`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `smbj30cah-etched.step` / `smbj30cah-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj30cah.step` / `smbj30cah.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Taiwan Semiconductor datasheet](docs/smbj30cah-datasheet.pdf) (8 pp, sha256 `1fcb5bfd7d31a686`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj30cah-datasheet.pdf)