component
SMBJ26CAH
Public Made by Adomby adom
Taiwan Semiconductor ESD And Surge Protection (TVS/ESD), DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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SMBJ26CAH
Taiwan Semiconductor · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)
SMBJ26CAH from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 28.9 | V | IT = 1 mA (Note 1) | 2 | ||
| Breakdown voltage (max) | VBR | 31.9 | V | IT = 1 mA (Note 1) | 2 | ||
| Maximum blocking leakage current | ID | 1 | µA | VWM = 26 V | 2 | ||
| Maximum peak impulse current | IPP | 14.9 | A | Surge current waveform per Fig. 3 (Note 2) | 2 | ||
| Maximum clamping voltage | VC | 42.1 | V | @ IPP = 14.9 A | 2 | ||
| Non-repetitive peak impulse power dissipation | PPK | 600 | W | 10/1000 µs waveform (Note 1) | 1 | ||
| Steady state power dissipation | PD | 3 | W | TA = 25°C | 1 | ||
| Junction temperature | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | °C | 1 | ||
| Junction-to-case thermal resistance | RθJC | 10 | °C/W | 2 | |||
| Junction-to-ambient thermal resistance | RθJA | 55 | °C/W | 2 |
CAD (KiCad official)
- Symbol:
SMBJ26CAH - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
smbj26cah-etched.step/smbj26cah-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj26cah.step/smbj26cah.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (8 pp, sha256
1fcb5bfd7d31a686, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ26CAH
**Taiwan Semiconductor** · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)
SMBJ26CAH from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 28.9 | | | V | IT = 1 mA (Note 1) | 2 |
| Breakdown voltage (max) | VBR | | | 31.9 | V | IT = 1 mA (Note 1) | 2 |
| Maximum blocking leakage current | ID | | | 1 | µA | VWM = 26 V | 2 |
| Maximum peak impulse current | IPP | | | 14.9 | A | Surge current waveform per Fig. 3 (Note 2) | 2 |
| Maximum clamping voltage | VC | | | 42.1 | V | @ IPP = 14.9 A | 2 |
| Non-repetitive peak impulse power dissipation | PPK | | | 600 | W | 10/1000 µs waveform (Note 1) | 1 |
| Steady state power dissipation | PD | | | 3 | W | TA = 25°C | 1 |
| Junction temperature | TJ | -55 | | 150 | °C | | 1 |
| Storage temperature | TSTG | -55 | | 150 | °C | | 1 |
| Junction-to-case thermal resistance | RθJC | | 10 | | °C/W | | 2 |
| Junction-to-ambient thermal resistance | RθJA | | 55 | | °C/W | | 2 |
## CAD (KiCad official)
- Symbol: `SMBJ26CAH`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `smbj26cah-etched.step` / `smbj26cah-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj26cah.step` / `smbj26cah.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Taiwan Semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590327962555363328) (8 pp, sha256 `1fcb5bfd7d31a686`, retrieved 2026-10-14, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj26cah-datasheet.pdf)