component
SMBJ26CA-TP
Public Made by Adomby adom
MCC(Micro Commercial Components) TVS, SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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SMBJ26CA-TP
MCC(Micro Commercial Components) · TVS · SMB(DO-214AA)
SMBJ26CA-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | V(BR) | 28.9 | 31.9 | V | @ IT = 1 mA | 5 | |
| Reverse Stand-Off Voltage | VWM | 26 | V | 5 | |||
| Maximum Clamping Voltage | VC | 42.1 | V | @ IPP = 14.2 A | 5 | ||
| Peak Pulse Current | IPP | 14.2 | A | 10/1000us waveform | 5 | ||
| Maximum Reverse Leakage | ID | 1 | μA | @ VWM | 5 | ||
| Peak Pulse Power Dissipation | PPP | 600 | W | Note 2,3 | 1 | ||
| Steady State Power Dissipation | PM(AV) | 5 | W | Note 7, infinite heat sink at TL=75°C | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 175 | °C | 1 | ||
| Storage Temperature Range | Tstg | -55 | 175 | °C | 1 | ||
| Maximum Soldering Temperature | 260 | °C | 10 seconds | 1 | |||
| Thermal Resistance Junction to Lead | RthJL | 20 | °C/W | 1 | |||
| Thermal Resistance Junction to Case | RthJC | 25 | °C/W | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
SMBJ26CA-TP - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
smbj26ca-tp-etched.step/smbj26ca-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj26ca-tp.step/smbj26ca-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC(Micro Commercial Components) datasheet (8 pp, sha256
70013c6690858fbb, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ26CA-TP
**MCC(Micro Commercial Components)** · TVS · SMB(DO-214AA)
SMBJ26CA-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | V(BR) | 28.9 | | 31.9 | V | @ IT = 1 mA | 5 |
| Reverse Stand-Off Voltage | VWM | | 26 | | V | | 5 |
| Maximum Clamping Voltage | VC | | | 42.1 | V | @ IPP = 14.2 A | 5 |
| Peak Pulse Current | IPP | | | 14.2 | A | 10/1000us waveform | 5 |
| Maximum Reverse Leakage | ID | | | 1 | μA | @ VWM | 5 |
| Peak Pulse Power Dissipation | PPP | | | 600 | W | Note 2,3 | 1 |
| Steady State Power Dissipation | PM(AV) | | | 5 | W | Note 7, infinite heat sink at TL=75°C | 1 |
| Operating Junction Temperature Range | TJ | -55 | | 175 | °C | | 1 |
| Storage Temperature Range | Tstg | -55 | | 175 | °C | | 1 |
| Maximum Soldering Temperature | | | | 260 | °C | 10 seconds | 1 |
| Thermal Resistance Junction to Lead | RthJL | | 20 | | °C/W | | 1 |
| Thermal Resistance Junction to Case | RthJC | | 25 | | °C/W | | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | copper pads to each terminal. | 1 |
## CAD (KiCad official)
- Symbol: `SMBJ26CA-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `smbj26ca-tp-etched.step` / `smbj26ca-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj26ca-tp.step` / `smbj26ca-tp.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/smbj26ca-tp-datasheet.pdf) (8 pp, sha256 `70013c6690858fbb`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj26ca-tp-datasheet.pdf)