component
SMBJ26CA-Q
Public Made by Adomby adom
BOURNS TVS, SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
SMBJ26CA-Q
BOURNS · TVS · SMB(DO-214AA)
SMBJ26CA-Q from BOURNS, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BOURNS |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 28.9 | V | @ IT (mA) = 1.0 | 2 | ||
| Breakdown Voltage | VBR | 31.9 | V | @ IT (mA) = 1.0 | 2 | ||
| Maximum Reverse Leakage | IR | 1 | µA | @ VRWM = 26 V | 2 | ||
| Maximum Clamping Voltage (10/1000 µs) | Vc | 42.1 | V | @ Ipp = 14.3 A (10/1000 µs) | 2 | ||
| Maximum Peak Pulse Current (10/1000 µs) | Ipp | 14.3 | A | (10/1000 µs) | 2 | ||
| Maximum Clamping Voltage (8/20 µs) | Vc | 54.7 | V | @ Ipp = 71.5 A (8/20 µs) | 2 | ||
| Maximum Peak Pulse Current (8/20 µs) | Ipp | 71.5 | A | (8/20 µs) | 2 | ||
| Minimum Peak Pulse Power Dissipation | PPK | 600 | Watts | TP = 1 ms (Note 1,2) | 1 | ||
| Peak Forward Surge Current | IFSM | 100 | Amps | 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) (Note 3) | 1 | ||
| Operating Temperature Range | TJ | -55 | 150 | °C | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 2. Mounted on 5.0 mm2 (0.03 mm thick) copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
SMBJ26CA-Q - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
smbj26ca-q-etched.step/smbj26ca-q-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj26ca-q.step/smbj26ca-q.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BOURNS datasheet (6 pp, sha256
fd33918f2c178a02, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ26CA-Q
**BOURNS** · TVS · SMB(DO-214AA)
SMBJ26CA-Q from BOURNS, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BOURNS |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 28.9 | | | V | @ IT (mA) = 1.0 | 2 |
| Breakdown Voltage | VBR | | | 31.9 | V | @ IT (mA) = 1.0 | 2 |
| Maximum Reverse Leakage | IR | | | 1 | µA | @ VRWM = 26 V | 2 |
| Maximum Clamping Voltage (10/1000 µs) | Vc | | | 42.1 | V | @ Ipp = 14.3 A (10/1000 µs) | 2 |
| Maximum Peak Pulse Current (10/1000 µs) | Ipp | | | 14.3 | A | (10/1000 µs) | 2 |
| Maximum Clamping Voltage (8/20 µs) | Vc | | | 54.7 | V | @ Ipp = 71.5 A (8/20 µs) | 2 |
| Maximum Peak Pulse Current (8/20 µs) | Ipp | | | 71.5 | A | (8/20 µs) | 2 |
| Minimum Peak Pulse Power Dissipation | PPK | 600 | | | Watts | TP = 1 ms (Note 1,2) | 1 |
| Peak Forward Surge Current | IFSM | | | 100 | Amps | 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) (Note 3) | 1 |
| Operating Temperature Range | TJ | -55 | | 150 | °C | | 1 |
| Storage Temperature Range | TSTG | -55 | | 150 | °C | | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | 2. Mounted on 5.0 mm2 (0.03 mm thick) copper pads to each terminal. | 1 |
## CAD (KiCad official)
- Symbol: `SMBJ26CA-Q`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `smbj26ca-q-etched.step` / `smbj26ca-q-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj26ca-q.step` / `smbj26ca-q.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [BOURNS datasheet](docs/smbj26ca-q-datasheet.pdf) (6 pp, sha256 `fd33918f2c178a02`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj26ca-q-datasheet.pdf)