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SMBJ18CA-TR

Public Made by Adom

by adom

STMicroelectronics ESD And Surge Protection (TVS/ESD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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SMBJ18CA-TR

STMicroelectronics · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)

SMBJ18CA-TR from STMicroelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current at 25 °C IRM 0.2 µA at VRM = 18 V, pulse tp < 50 ms, Tamb 25 °C 3
Reverse leakage current at 85 °C IRM 1 µA at VRM = 18 V, pulse tp < 50 ms, 85 °C 3
Breakdown voltage VBR 20 21.1 V at IR = 1 mA 3
Clamping voltage, 10/1000 µs waveform VCL 29.2 V 10/1000 µs 3
Peak pulse current, 10/1000 µs waveform IPP 21.5 A 10/1000 µs 3
Dynamic resistance, 10/1000 µs waveform RD 0.328 Ω 10/1000 µs 3
Clamping voltage, 8/20 µs waveform VCL 39.3 V 8/20 µs 3
Peak pulse current, 8/20 µs waveform IPP 102 A 8/20 µs 3
Dynamic resistance, 8/20 µs waveform RD 0.168 Ω 8/20 µs 3
Breakdown voltage temperature coefficient αT 9.2 10-4/°C 3
Peak pulse power dissipation PPP 600 W Tj initial = Tamb, 10/1000 µs 2
Operating junction temperature range Tj -55 150 °C 2
Storage temperature range Tstg -65 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Thermal resistance junction to leads Rth(j-l) 20 °C/W junction to leads 2
Thermal resistance junction to ambient Rth(j-a) 100 °C/W on printed circuit on recommended pad layout 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper versus copper surface under each lead (printed 5

CAD (KiCad official)

  • Symbol: SMBJ18CA-TR
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj18ca-tr-etched.step / smbj18ca-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj18ca-tr.step / smbj18ca-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (11 pp, sha256 6d6fe330cf55be51, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF