component
SMBJ170A
Public Made by Adomby adom
MDD（Microdiode Electronics） TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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SMBJ170A
MDD（Microdiode Electronics） · TVS · DO-214AA(SMB)
SMBJ170A from MDD（Microdiode Electronics）, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPPM | 600 | W | 10/1000μs waveform (Note1, Note2, Fig.1) | 1 | ||
| Peak forward surge current | IFSM | 100 | A | 8.3ms single half sine-wave, JEDEC Method (Note3, Fig.6) | 1 | ||
| Steady state power dissipation | PM(AV) | 5 | W | TA=50℃ (Fig.5) | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -65 | 150 | ℃ | 1 | ||
| Thermal resistance junction to lead | RθJL | 20 | ℃/W | Typical | 1 | ||
| Thermal resistance junction to ambient | RθJA | 100 | ℃/W | Typical | 1 | ||
| Breakdown voltage (SMBJ170A) | VBR | 189 | 209 | V | @IT=1 mA | 3 | |
| Maximum clamping voltage (SMBJ170A) | VC | 275 | V | @IPP=2.2 A | 3 | ||
| Reverse leakage (SMBJ170A) | IR | 1 | μA | @VRWM=170.0 V | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
SMBJ170A - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
smbj170a-etched.step/smbj170a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj170a.step/smbj170a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MDD（Microdiode Electronics） datasheet (5 pp, sha256
95385273b5009dc9, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ170A
**MDD（Microdiode Electronics）** · TVS · DO-214AA(SMB)
SMBJ170A from MDD（Microdiode Electronics）, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPPM | 600 | | | W | 10/1000μs waveform (Note1, Note2, Fig.1) | 1 |
| Peak forward surge current | IFSM | | | 100 | A | 8.3ms single half sine-wave, JEDEC Method (Note3, Fig.6) | 1 |
| Steady state power dissipation | PM(AV) | | | 5 | W | TA=50℃ (Fig.5) | 1 |
| Operating junction and storage temperature range | TJ,TSTG | -65 | | 150 | ℃ | | 1 |
| Thermal resistance junction to lead | RθJL | | 20 | | ℃/W | Typical | 1 |
| Thermal resistance junction to ambient | RθJA | | 100 | | ℃/W | Typical | 1 |
| Breakdown voltage (SMBJ170A) | VBR | 189 | | 209 | V | @IT=1 mA | 3 |
| Maximum clamping voltage (SMBJ170A) | VC | | | 275 | V | @IPP=2.2 A | 3 |
| Reverse leakage (SMBJ170A) | IR | | | 1 | μA | @VRWM=170.0 V | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
## CAD (KiCad official)
- Symbol: `SMBJ170A`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `smbj170a-etched.step` / `smbj170a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj170a.step` / `smbj170a.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MDD（Microdiode Electronics） datasheet](docs/smbj170a-datasheet.pdf) (5 pp, sha256 `95385273b5009dc9`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj170a-datasheet.pdf)