# SMBJ15CAE3

**Microsemi** · TVS · DO-214AA(SMBJ)

SMBJ15CAE3 from Microsemi, in a DO-214AA(SMBJ). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microsemi |
| Package | DO-214AA(SMBJ) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power dissipation at 25°C | PPP |  |  | 600 | W | 10/1000 µs waveform, 25°C | 1 |
| Impulse repetition rate (duty factor) |  |  |  | 0.01 | % |  | 1 |
| Operating and storage temperature |  | -65 |  | 150 | °C | operating and storage | 1 |
| Steady-state power dissipation |  |  |  | 5 | W | TL = 25°C | 1 |
| Steady-state power dissipation |  |  |  | 1.38 | W | TA = 25°C, mounted on FR4 PC board with recommended footprint | 1 |
| Solder temperature |  |  |  | 260 | °C | 10 s maximum | 1 |
| Clamping time (0 V to V(BR) min.), bidirectional | tclamping |  |  | 5 | ns | bidirectional; theoretical; unidirectional is < 100 ps | 1 |
| Thermal resistance, junction to lead |  |  | 25 |  | °C/W | junction to lead | 1 |
| Thermal resistance, junction to ambient |  |  | 90 |  | °C/W | mounted on FR4 PC board (1 oz Cu) with recommended footprint | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • TERMINALS: Gull-wing or C-bend (modified J-bend) tin-lead or RoHS compliant annealed matte-tin plating | 1 |

## CAD (KiCad official)

- Symbol: `SMBJ15CAE3`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMBJ) (KiCad packages3D, STEP)

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microsemi datasheet](docs/smbj15cae3-datasheet.pdf) (4 pp, sha256 `0d96c58e852a1bc5`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smbj15cae3-datasheet.pdf)