component
SMBJ13D-M3
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Vishay Intertech TVS, DO-214AA(SMBJ). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SMBJ13D-M3
Vishay Intertech · TVS · DO-214AA(SMBJ)
SMBJ13D-M3 from Vishay Intertech, in a DO-214AA(SMBJ). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, marked by the cathode band on unidirectional types such as SMBJ13D (VWM 13 V, VBR 14.6 V to 15.7 V at 1.0 mA). |
| 2 | A | passive | Anode, the end without the cathode band; the device clamps to 21.2 V maximum at 28.3 A peak pulse current (600 W 10/1000 μs). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | DO-214AA(SMBJ) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | VBR | 14.6 | 15.7 | V | at IT = 1.0 mA, pulse test tp ≤ 50 ms | 2 | |
| Test current | IT | 1 | mA | 2 | |||
| Stand-off voltage | VWM | 13 | V | 2 | |||
| Maximum reverse leakage | ID | 0.5 | μA | at VWM | 2 | ||
| Maximum peak pulse surge current | IPPM | 28.3 | A | surge current waveform per fig. 3, derate per fig. 2 | 2 | ||
| Maximum clamping voltage | VC | 21.2 | V | at IPPM | 2 | ||
| VBR tolerance | VBR | -3.5 | 3.5 | % | 1 | ||
| Peak pulse power dissipation | PPPM | 600 | W | 10/1000 μs waveform, TA = 25 °C | 1 | ||
| Power dissipation (infinite heatsink) | PD | 5 | W | TM = 50 °C | 1 | ||
| Power dissipation (min pad layout) | PD | 1 | W | TA = 25 °C | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Thermal resistance, junction to ambient (min pad layout) | RθJA | 125 | °C/W | Mounted on minimum recommended pad layout | 3 | ||
| Thermal resistance, junction to ambient (5.0 mm x 5.0 mm Cu pad) | RθJA | 100 | °C/W | Mounted on 5.0 mm x 5.0 mm copper pad area | 3 | ||
| Thermal resistance, junction to mount | RθJM | 20 | °C/W | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
CAD (KiCad official)
- Symbol:
SMBJ13D-M3 - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMBJ) (KiCad packages3D, STEP)
- 3D model files:
smbj13d-m3-etched.step/smbj13d-m3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj13d-m3.step/smbj13d-m3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (5 pp, sha256
c1e92b4c130e4dc1, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ13D-M3
**Vishay Intertech** · TVS · DO-214AA(SMBJ)
SMBJ13D-M3 from Vishay Intertech, in a DO-214AA(SMBJ). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, marked by the cathode band on unidirectional types such as SMBJ13D (VWM 13 V, VBR 14.6 V to 15.7 V at 1.0 mA). |
| 2 | A | passive | Anode, the end without the cathode band; the device clamps to 21.2 V maximum at 28.3 A peak pulse current (600 W 10/1000 μs). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | DO-214AA(SMBJ) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | VBR | 14.6 | | 15.7 | V | at IT = 1.0 mA, pulse test tp ≤ 50 ms | 2 |
| Test current | IT | | 1 | | mA | | 2 |
| Stand-off voltage | VWM | | 13 | | V | | 2 |
| Maximum reverse leakage | ID | | | 0.5 | μA | at VWM | 2 |
| Maximum peak pulse surge current | IPPM | | | 28.3 | A | surge current waveform per fig. 3, derate per fig. 2 | 2 |
| Maximum clamping voltage | VC | | | 21.2 | V | at IPPM | 2 |
| VBR tolerance | VBR | -3.5 | | 3.5 | % | | 1 |
| Peak pulse power dissipation | PPPM | | | 600 | W | 10/1000 μs waveform, TA = 25 °C | 1 |
| Power dissipation (infinite heatsink) | PD | | | 5 | W | TM = 50 °C | 1 |
| Power dissipation (min pad layout) | PD | | | 1 | W | TA = 25 °C | 1 |
| Operating junction and storage temperature range | TJ, TSTG | -55 | | 150 | °C | | 1 |
| Thermal resistance, junction to ambient (min pad layout) | RθJA | | 125 | | °C/W | Mounted on minimum recommended pad layout | 3 |
| Thermal resistance, junction to ambient (5.0 mm x 5.0 mm Cu pad) | RθJA | | 100 | | °C/W | Mounted on 5.0 mm x 5.0 mm copper pad area | 3 |
| Thermal resistance, junction to mount | RθJM | | 20 | | °C/W | | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
## CAD (KiCad official)
- Symbol: `SMBJ13D-M3`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMBJ) (KiCad packages3D, STEP)
- 3D model files: `smbj13d-m3-etched.step` / `smbj13d-m3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj13d-m3.step` / `smbj13d-m3.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](docs/smbj13d-m3-datasheet.pdf) (5 pp, sha256 `c1e92b4c130e4dc1`, retrieved 2026-10-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj13d-m3-datasheet.pdf)