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Contents

README

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SMBJ130A M4G

Taiwan Semiconductor · TVS · DO-214AA(SMB)

SMBJ130A M4G from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the unidirectional TVS, marked by the cathode band, with VWM 130 V, VBR 144-159 V at 1 mA and maximum VC 209 V at IPP 3.0 A.
2 A passive Anode of the unidirectional TVS, the end opposite the cathode band, connected to the protected circuit's return or ground side.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package DO-214AA(SMB)
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage VBR 144 159 V @ IT = 1 mA, TA = 25°C 3
Test current IT 1 mA VBR test current 3
Working stand-off voltage VWM 130 V TA = 25°C 3
Maximum blocking leakage current ID 1 µA @ VWM 3
Maximum peak impulse current IPP 3 A Surge waveform per Fig.3, derate per Fig.2 3
Maximum clamping voltage VC 209 V @ IPP 3
Non-repetitive peak impulse power dissipation PPK 600 W 10/1000µs waveform, TA = 25°C 1
Steady state power dissipation PD 3 W TA = 25°C 1
Peak forward surge current IFSM 100 A 8.3ms single half sine-wave superimposed on rated load, uni-directional only 1
Forward voltage VF 5 V IF = 50A, uni-directional only; 5.0V on SMBJ100 - SMBJ170 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction-to-case thermal resistance RӨJC 10 °C/W 2
Junction-to-ambient thermal resistance RӨJA 55 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: SMBJ130A M4G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: smbj130a-m4g-etched.step / smbj130a-m4g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj130a-m4g.step / smbj130a-m4g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (8 pp, sha256 6b1cb45d62a964cc, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF