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Contents

README

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SMBJ12CA-TR

STMicroelectronics · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)

SMBJ12CA-TR from STMicroelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current at VRM, 25 °C IRM 0.2 µA at VRM, Tj = 25 °C 3
Reverse leakage current at VRM, 85 °C IRM 1 µA at VRM, Tj = 85 °C 3
Breakdown voltage VBR 13.3 14 V at IR = 1 mA 3
Clamping voltage, 10/1000 µs VCL 19.9 V 10/1000 µs waveform, IPP = 31 A 3
Peak pulse current, 10/1000 µs IPP 31 A 10/1000 µs waveform 3
Dynamic resistance, 10/1000 µs RD 0.168 Ω 10/1000 µs waveform 3
Clamping voltage, 8/20 µs VCL 25.3 V 8/20 µs waveform, IPP = 157 A 3
Peak pulse current, 8/20 µs IPP 157 A 8/20 µs waveform 3
Dynamic resistance, 8/20 µs RD 0.068 Ω 8/20 µs waveform 3
Peak pulse power dissipation PPP 600 W Tj initial = Tamb 2
Operating junction temperature range Tj -55 150 °C 2
Storage temperature range Tstg -65 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Junction to leads thermal resistance Rth(j-l) 20 °C/W junction to leads 2
Junction to ambient thermal resistance Rth(j-a) 100 °C/W junction to ambient on printed circuit on recommended pad layout 2
Stand-off voltage VRM 12 V reverse stand-off voltage (SMBJ12CA) 3
Temperature coefficient of VBR/VCL αT 8.3 10-4/°C VBR at TJ = VBR at 25 °C x (1 + αT x (TJ - 25)) 3

CAD (KiCad official)

  • Symbol: SMBJ12CA-TR
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj12ca-tr-etched.step / smbj12ca-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj12ca-tr.step / smbj12ca-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (11 pp, sha256 6d6fe330cf55be51, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF