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SMBJ12CA-T3

baocheng(Shandong Baocheng Elec) · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)

SMBJ12CA-T3 from baocheng(Shandong Baocheng Elec), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Bidirectional (CA suffix) TVS terminal 1; no polarity, color band not used on bi-directional models, and either terminal can be connected to the positive side (VRWM 12V, VBR 13.30~14.70V at 1mA, VC 19.9V at 30.2A IPP).
2 A2 passive Bidirectional (CA suffix) TVS terminal 2; no polarity, color band not used on bi-directional models, and either terminal can be connected to the positive side (VRWM 12V, VBR 13.30~14.70V at 1mA, VC 19.9V at 30.2A IPP).

Key specifications

Parameter Value
Manufacturer baocheng(Shandong Baocheng Elec)
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 13.3 14.7 V @IT = 1 mA 2
Reverse Stand-Off Voltage VRWM 12 V 2
Test Current IT 1 mA 2
Maximum Clamping Voltage VC 19.9 V @IPP = 30.2 A 2
Peak Pulse Current IPP 30.2 A 10/1000μs waveform 2
Reverse Leakage IR 1 μA @VRWM 2
Peak pulse power dissipation PPPM 600 Watts 10/1000μs waveform (Note1, Note2, Fig.1), Minimum 600 1
Steady state power dissipation PM(AV) 5 Watts TA=50℃ (Fig.5) 1
Peak forward surge current IFSM 100 Amps 8.3ms single half sine-wave superimposed on rated load, (JEDEC Method) (Note3, Fig.6) 1
Operating junction and storage temperature range TJ,TSTG -55 150 ℃ 1
Typical thermal resistance junction to lead RθJL 20 ℃/W 1
Typical thermal resistance junction to ambient RθJA 100 ℃/W 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminal: Tin plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode except bi-directional models 1

CAD (KiCad official)

  • Symbol: SMBJ12CA-T3
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj12ca-t3-etched.step / smbj12ca-t3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj12ca-t3.step / smbj12ca-t3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: baocheng(Shandong Baocheng Elec) datasheet (4 pp, sha256 8c5cbf56e3da0cb1, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF