# SMB5362A

**XCH(旭昌辉)** · IC · SMB

SMB5362A from XCH(旭昌辉), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, marked by the color band on the package; for SMB5362A the nominal zener voltage is 28 V (26.60 V min to 29.40 V max) and the DC power dissipation is 5.0 W at TL = 75 °C. |
| 2 | A | passive | Anode, the end without the color band; maximum forward voltage is 1.2 V at 200 mA and junction/storage temperature is -55 to +150 °C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XCH(旭昌辉) |
| Package | SMB |
| Category |  |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage (nominal, AVE.) | VZ | 26.6 | 28 | 29.4 | V | @IZT 6.0 mA (per row); device tolerance ±5% (remark) | 3 |
| Maximum zener impedance | ZZT |  |  | 50 | Ω | @IZT 6.0 mA | 3 |
| Maximum zener impedance (knee) | ZZK |  |  | 130 | Ω | @IZK 1.00 mA | 3 |
| Maximum reverse leakage current | IR |  |  | 0.5 | uA | @VR 21.2 V | 3 |
| Maximum DC zener current | IZM |  |  | 170 | mA |  | 3 |
| Maximum forward voltage | VF |  |  | 1.2 | V | at if=200mA | 1 |
| DC power dissipation | PD |  |  | 5 | W | at TL = 75 °C (note 1) | 1 |
| Junction temperature range | TJ，TSTG | -55 |  | 150 | ℃ |  | 1 |
| Storage temperature range | TJ，TSTG | -55 |  | 150 | ℃ |  | 1 |
| Typical thermal resistance, junction to ambient | RθJA |  | 65 |  | ℃/W | junction to ambient, mounted on 8.0 mm x 8.0 mm copper pad areas (note 2) | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | （2）Thermal resistance from junction to ambient and from junction to lead mounted on P. 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas. | 1 |

## CAD (KiCad official)

- Symbol: `SMB5362A`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `smb5362a-etched.step` / `smb5362a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smb5362a.step` / `smb5362a.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XCH(旭昌辉) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603201118650716160) (3 pp, sha256 `cc44843246128500`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smb5362a-datasheet.pdf)