# SMB10J100CA-TP

**MCC(Micro Commercial Components)** · TVS · SMB

SMB10J100CA-TP from MCC(Micro Commercial Components), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (bidirectional SMB10J100CA) | VBR | 111 |  |  | V | @ IT = 1 mA | 2 |
| Breakdown voltage (bidirectional SMB10J100CA) | VBR |  |  | 123 | V | @ IT = 1 mA | 2 |
| Maximum reverse leakage current | IR |  |  | 1 | µA | @ VRWM | 2 |
| Maximum reverse surge current | IPP |  |  | 6.17 | A |  | 2 |
| Maximum clamping voltage | VC@IPP |  |  | 162 | V | @ IPP | 2 |
| Peak pulse power dissipation | PPP |  |  | 1000 | W | Note 3: non-repetitive pulse per Fig.3, derated above TA=25°C per Fig.4 | 1 |
| Power dissipation on infinite heat sink | PD |  |  | 5 | W | TL = 75°C | 1 |
| Peak forward surge current | IFSM |  |  | 100 | A | Note 4: 8.3 ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum | 1 |
| Operating junction temperature range |  | -55 |  | 150 | °C |  | 1 |
| Storage temperature range |  | -55 |  | 150 | °C |  | 1 |
| Working peak reverse voltage | VRWM |  | 100 |  | V |  | 2 |

## CAD (KiCad official)

- Symbol: `SMB10J100CA-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `smb10j100ca-tp-etched.step` / `smb10j100ca-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smb10j100ca-tp.step` / `smb10j100ca-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/smb10j100ca-tp-datasheet.pdf) (4 pp, sha256 `bab11ff93ec2d996`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smb10j100ca-tp-datasheet.pdf)